Chong, Wei-Wen
420  results:
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1

MERMAID: A Dataset and Framework for Multimodal Meme Semant..:

, In: 2023 IEEE International Conference on Big Data (BigData),
Toh, Shaun ; Kuek, Adriel ; Chong, Wen-Haw. - p. 433-442 , 2023
 
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2

Pro-Cap: Leveraging a Frozen Vision-Language Model for Hate..:

, In: Proceedings of the 31st ACM International Conference on Multimedia,
Cao, Rui ; Hee, Ming Shan ; Kuek, Adriel... - p. 5244-5252 , 2023
 
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3

On Explaining Multimodal Hateful Meme Detection Models:

, In: Proceedings of the ACM Web Conference 2022,
Hee, Ming Shan ; Lee, Roy Ka-Wei ; Chong, Wen-Haw - p. 3651-3655 , 2022
 
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4

Disentangling Hate in Online Memes:

, In: Proceedings of the 29th ACM International Conference on Multimedia,
Lee, Roy Ka-Wei ; Cao, Rui ; Fan, Ziqing.. - p. 5138-5147 , 2021
 
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5

Contributors:

, In: Principles of Multiple-Liquid Separation Systems,
 
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6

Multimodal Zero-Shot Hateful Meme Detection:

, In: 14th ACM Web Science Conference 2022,
Zhu, Jiawen ; Lee, Roy Ka-Wei ; Chong, Wen Haw - p. 382-389 , 2022
 
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7

Automatic Response Method of Grid Demand Under the Backgrou..:

, In: IoT and Big Data Technologies for Health Care; Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering,
Xu, Wen-tao ; Ma, Chong-wei ; Wang, Guo-bin.. - p. 71-87 , 2022
 
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8

A self-tuning piezoelectric vibration absorber with voltage..:

, In: 2022 IEEE 31st International Symposium on Industrial Electronics (ISIE),
Chong, Chen ; Wei, Tang ; Wen, Cao.. - p. 1012-1017 , 2022
 
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9

Self-Training Domain Adaptation Via Weight Transmission Bet..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Wei, Xing ; Ji, Zhaoxin ; Yang, Fan... - p. 3280-3284 , 2024
 
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10

Contrastive Domain Adaptation Via Delimitation Discriminato:

, In: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Wei, Xing ; Wen, Bin ; Chen, Lei... - p. 1-5 , 2023
 
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11

Weighted Sampling for Masked Language Modeling:

, In: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Zhang, Linhan ; Chen, Qian ; Wang, Wen... - p. 1-5 , 2023
 
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12

Comprehensive study on effect of chip layout and mold thick..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
 
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13

A Portable X-ray Flaw Detection Equipment with High Voltage..:

, In: 2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE),
Liu, Da-Wei ; Yao, Jian-Li ; Ni, Hong-Yu.. - p. 1-4 , 2022
 
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14

Development of a Digital Resources Sharing Platform for the..:

, In: 2022 IEEE-EMBS Conference on Biomedical Engineering and Sciences (IECBES),
 
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15

Comprehensive Study on Die Shift with Ultra-Large Embedded ..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Seit, Wen Wei ; Chong, Ser Choong ; Lim, Sharon. - p. 150-155 , 2022
 
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