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2019 IEEE International Electron Devices Meeting (IEDM) ,
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Non-Planarization Cu-Cu Direct Bonding and Gang Bonding wit..:
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Proceedings of the 2019 3rd International Conference on E-Society, E-Education and E-Technology ,
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The Influence of Problem-Based Learning on University Stude..:
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2023 International Electron Devices Meeting (IEDM) ,
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First Demonstration of Highly Scaled Atomic Layer Deposited..:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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Effects of In/Zn composition on the Performance of Ultra-th..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Aggressively Scaled Atomic Layer Deposited Amorphous InZnOx..:
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2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) ,
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Chemical-mechanical polishing (CMP) process of STI and DTI-..:
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Digital Heritage. Progress in Cultural Heritage: Documentation, Preservation, and Protection; Lecture Notes in Computer Science ,
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A Framework for Semantic Interoperability in 3D Tangible Cu..:
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Numerical Weather Prediction: East Asian Perspectives; Springer Atmospheric Sciences ,
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Evaluating the Assimilation of Observable and Retrievable W..:
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Proceedings of the 2020 Asia Service Sciences and Software Engineering Conference ,
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A Variant Model of TGAN for Music Generation:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Active Antenna Subsystem Integration of Steerable Boresight..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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One-dimensional Steerable End-fire Orthogonal Beams for 5G ..:
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Proceedings of the 22nd annual ACM computer science conference on Scaling up : meeting the challenge of complexity in real-world computing applications: meeting the challenge of complexity in real-world computing applications ,
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Algebraic Petri nets and their applications:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
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