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Chu, Baojin
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1

Enhanced Thermal Conductivity of Epoxy Adhesive Films by Fi..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xu, Yuping ; Xu, PengPeng ; Li, Peng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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2

A Study on Transmission Loss of Build-up Film Applied to IC..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Kong, Weikun ; Chen, Wenbo ; Zhong, Cheng... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Enhanced thermomechanical and dielectric properties of the ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Zheng ; Luo, Suibin ; Chu, Baojin. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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4

Preparation and properties of UV curable SiO2/Epoxy resin c..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Hui ; Liu, Zheqin ; Luo, Suibin... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Fabrication and properties of modified PVDF dielectric film..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Min, Yufeng ; Li, Peng ; Yu, Junyi... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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6

Flexoelectric or Flexoelectric-Like Effect in Ceramics:

, In: Reference Module in Materials Science and Materials Engineering,
Tian, Dongxia ; Chu, Baojin ; Chen, Pan.. , 2022
Link: https://doi.org/10.1016/..
 
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7

Thermomechanical and Electrical Properties of the $\text{Si..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Li, Chaofan ; Luo, Suibin ; Yu, Shuhui.. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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8

List of Contributors:

, In: Dielectric Polymer Materials for High-Density Energy Storage,
Chu, Baojin ; Dang, Zhi-Min ; Gu, Aijuan... - p. xiii , 2018
Link: https://doi.org/10.1016/..
 
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9

Charging and Discharging Characteristics of Dielectric Poly..:

, In: Dielectric Polymer Materials for High-Density Energy Storage,
Chu, Baojin ; Zhou, Yang ; Zhang, Shihai - p. 351-382 , 2018
Link: https://doi.org/10.1016/..
 
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