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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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Geothermal Geological Characteristics and Utilization of Ge..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2020 ,
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Contribution Accumulation Conditions and Exploration Prospe..:
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Security with Intelligent Computing and Big-data Services; Advances in Intelligent Systems and Computing ,
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A Pi-Based Beehive IoT System Design:
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2014 International Conference on Management Science & Engineering 21th Annual Conference Proceedings ,
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Research on the structure and measurement of Virtual Enterp..:
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Proceedings. 7th International Conference on Solid-State and Integrated Circuits Technology, 2004. ,
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Fabrication of strained Si channel PMOSFET on thin relaxed ..:
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2020 Indo – Taiwan 2nd International Conference on Computing, Analytics and Networks (Indo-Taiwan ICAN) ,
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Health Detection for Potato Leaf with Convolutional Neural ..:
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2024 IEEE International Conference on Consumer Electronics (ICCE) ,
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Model Efficiency Improvement with Simplified Architectures:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
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Stress Sensitivity Characterization of Threshold Pressure G..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
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Effect of Alternating Load on Sand Production of Gas Storag:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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Effects of In/Zn composition on the Performance of Ultra-th..:
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ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC) ,
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A 433-MHz Wireless Burst-Chirp Modulation Transmitter with ..:
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2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE) ,
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Conductivity gradient optimization of superficial layer for..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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