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Chung, Cheng-Chih
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1

List of contributors:

, In: Power Generation Technologies for Low-Temperature and Distributed Heat,
Akbarzadeh, Aliakbar ; Al-Masri, Danah ; Chen, Chin-Chung... - p. xiii-xiv , 2023
Link: https://doi.org/10.1016/..
 
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7.6 A 70.85-86.27TOPS/W PVT-Insensitive 8b Word-Wise ACIM w..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Hsieh, Sung-En ; Wei, Chun-Hao ; Xue, Cheng-Xin... - p. 136-138 , 2023
Link: https://doi.org/10.1109/..
 
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3

A 12-nm 0.62-1.61 mW Ultra-Low Power Digital CIM-based Deep..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chang, En-Jui ; Xue, Cheng-Xin ; Deshpande, Chetan... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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4

7.1 A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Acc..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lin, Chien-Hung ; Cheng, Chih-Chung ; Tsai, Yi-Min... - p. 134-136 , 2020
Link: https://doi.org/10.1109/..
 
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5

Study on Thermoelectric Conversion and Conjugate Heat Trans..:

, In: 2019 IEEE International Conference on Computation, Communication and Engineering (ICCCE),
Lin, Ah-Der ; Cheng, Chih-Chung ; Zheng, Poon Sian... - p. 226-229 , 2019
Link: https://doi.org/10.1109/..
 
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6

MIH-Based Congestion Control with Seamless Handover in Untr..:

, In: Innovative Mobile and Internet Services in Ubiquitous Computing; Advances in Intelligent Systems and Computing,
Leu, Fang-Yie ; Cheng, Chih-Chung - p. 502-510 , 2017
Link: https://doi.org/10.1007/..
 
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7

A Leakage Analysis Methodology Considering Intra-Cell and I..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Xu, Jiayi ; Tsai, Chia-Yu ; Huang, Heng-Liang... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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8

A door lock system with augmented reality technology:

, In: 2017 IEEE 6th Global Conference on Consumer Electronics (GCCE),
Hung, Chi-Huang ; Fanjiang, Yong-Yi ; Chung, Kun-Chih. - p. 1-2 , 2017
Link: https://doi.org/10.1109/..
 
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9

CAMPUS: A University Crowdsourcing Platform for Reporting F..:

, In: Companion Publication of the 2022 Conference on Computer Supported Cooperative Work and Social Computing,
Chung, Chih-Chi ; Lin, Yen-Chun ; Wang, Yu-Cheng... - p. 59-62 , 2022
Link: https://dl.acm.org/doi/1..
 
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10

Regarding the Virtual Reality Environment Design and Evalua..:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Chung, Chih-Chao ; Cheng, Yuh-Ming ; Lou, Shi-Jer - p. 102-110 , 2021
Link: https://doi.org/10.1007/..
 
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11

Development of a VR STEAM Welding Project Course:

, In: Lecture Notes in Computer Science; Innovative Technologies and Learning,
Chung, Chih-Chao ; Tung, Chun-Chun ; Cheng, Yuh-Ming. - p. 84-92 , 2020
Link: https://doi.org/10.1007/..
 
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12

Open Data Cube (ODC) in Taiwan: The Initiative and Protocol..:

, In: IGARSS 2019 - 2019 IEEE International Geoscience and Remote Sensing Symposium,
Cheng, Ming-Chih ; Chiou, Chi-Ryong ; Chen, Bo... - p. 5654-5657 , 2019
Link: https://doi.org/10.1109/..
 
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13

Machine Learning Hyperparameter Fine Tuning Service on Dyna..:

, In: Proceedings of the International Symposium on Big Data and Artificial Intelligence,
Peng, Yu-Hsiang ; Chuang, Chia-Chuan ; Wu, Zhou-Jin... - p. 22-28 , 2018
Link: https://dl.acm.org/doi/1..
 
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34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
Link: https://doi.org/10.1109/..
 
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15

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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