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Chung, Wei-Hsin
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1

17.3 A 14b 16GS/s Time-Interleaving Oirect-RF Synthesis OAe..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Tseng, Wei-Hsin ; Lin, Willy ; Hsu, Chung-Wei... - p. 268-270 , 2023
Link: https://doi.org/10.1109/..
 
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2

Contributors:

, In: Low-Dimensional Halide Perovskites,
Abdi, Yaser ; Ahmed, Irfan ; Ansari, Jamilur R.... - p. ix-xii , 2023
Link: https://doi.org/10.1016/..
 
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3

Modeling of the CPS1 for the Frequency Constrained Unit Com..:

, In: 2019 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC),
Chiu, Hsin-Wei ; Lin, Yu-Lin ; Chang-Chien, Le-Ren. - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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4

The effectiveness of the handheld devices based on mobiles ..:

, In: Proceedings of the 2nd International Conference on Interaction Sciences: Information Technology, Culture and Human,
Liu, Chung-Hsin ; Chen, Wei-Yu - p. 400-405 , 2009
Link: https://dl.acm.org/doi/1..
 
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5

Support and optimization of Java RMI over bluetooth environ..:

, In: Proceedings of the 2002 joint ACM-ISCOPE conference on Java Grande,
Wei, Pu-Chen ; Chen, Chung-Hsin ; Chen, Cheng-Wei. - p. 237 ff. , 2002
Link: https://dl.acm.org/doi/1..
 
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6

TNP: A Step Towards Elastic Training:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Yeng, Li-Chung ; Lee, Wei-Tsong ; Wei, Hsin-Wen - p. 15-16 , 2023
Link: https://doi.org/10.1109/..
 
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7

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Shih, Ming-En ; Hsieh, Shih-Wei ; Tsai, Ping-Yuan... - p. 360-362 , 2024
Link: https://doi.org/10.1109/..
 
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8

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
Link: https://doi.org/10.1109/..
 
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9

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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10

Monolayer-MoS2 Stacked Nanosheet Channel with C-type Metal ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chung, Yun-Yan ; Yun, Wei-Sheng ; Chou, Bo-Jhih... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Vector Field-Based Guidance Method for Collision Avoidance ..:

, In: 2023 IEEE Underwater Technology (UT),
Chen, Qing-Da ; Huang, Sheng-Wei ; Ho, Ming-Hsin... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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12

PLI-Based Connectivity in Resting-EEG is a Robust and Gener..:

, In: 2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Trinh, Thanh-Tung ; Liu, Yi-Hung ; Wu, Chien-Te... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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13

Status and Performance of Integration Modules Toward Scaled..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chou, Ang-Sheng ; Hsu, Ching-Hao ; Lin, Yu-Tung... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

Learning Adaptation and Generalization from Human-Inspired ..:

, In: 2023 IEEE Sixth International Conference on Artificial Intelligence and Knowledge Engineering (AIKE),
Ho, Joshua ; Wang, Chien-Min ; King, Chung-Ta... - p. 9-16 , 2023
Link: https://doi.org/10.1109/..
 
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15

Low N-Type Contact Resistance to Carbon Nanotubes in Highly..:

, In: 2023 International Electron Devices Meeting (IEDM),
Safron, Nathaniel ; Chiu, Hsin-Yuan ; Chao, Tzu-Ang... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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