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2023 International Electron Devices Meeting (IEDM) ,
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NVDRAM: A 32Gb Dual Layer 3D Stacked Non-volatile Ferroelec..:
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2020 5th International Conference on Advanced Technologies for Signal and Image Processing (ATSIP) ,
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Why To Model Remote Sensing Measurements In 3d? Recent Adva..:
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2019 19th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) ,
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Performance Modeling and Design of High Energy Density Micr..:
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Stuart Succession Literature ,
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'Stampt with your own Image': The Numismatic Dimension of T..:
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Proceedings of the 7th Workshop on Latest Advances in Scalable Algorithms for Large-Scale Systems ,
5
Performance scaling variability and energy analysis for a r..:
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Handbook of Flexible Organic Electronics ,
8
Integrated printing for 2D/3D flexible organic electronic d..:
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Blood Substitutes, Present and Future Perspectives ,
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Tissue Oxygen Delivery and Tissue Distribution of Liposome ..:
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Biophotonics and Biosensing ,
14