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Dai, Wei-Guo
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1

Gridless Joint Multi-Band DOA Estimation for Spectrum Sensi..:

, In: 2023 IEEE 9th International Workshop on Computational Advances in Multi-Sensor Adaptive Processing (CAMSAP),
Guo, Zhengang ; Dai, Wei - p. 311-315 , 2023
Link: https://doi.org/10.1109/..
 
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2

Structured Errors-in-Variables Modelling for Cortico-Muscul..:

, In: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Guo, Zhenghao ; McClelland, Verity M. ; Dai, Wei. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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3

Transformer-Based Hierarchical Clustering for Brain Network..:

, In: 2023 IEEE 20th International Symposium on Biomedical Imaging (ISBI),
Dai, Wei ; Cui, Hejie ; Kan, Xuan... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

Transformer-Based Hierarchical Clustering for Brain Network..:

, In: 2022 IEEE International Conference on Big Data (Big Data),
Dai, Wei ; Cui, Hejie ; Kan, Xuan.. - p. 4970-4971 , 2022
Link: https://doi.org/10.1109/..
 
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5

BrainGB: A Benchmark for Brain Network Analysis with Graph ..:

, In: 2022 IEEE International Conference on Big Data (Big Data),
Cui, Hejie ; Dai, Wei ; Zhu, Yanqiao... - p. 4968-4969 , 2022
Link: https://doi.org/10.1109/..
 
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6

Sensitive Features Extraction of Wear Monitoring Signals Ba..:

, In: 2022 13th International Conference on Reliability, Maintainability, and Safety (ICRMS),
Duan, Weiwei ; Dai, Wei ; Guo, Shi.. - p. 196-200 , 2022
Link: https://doi.org/10.1109/..
 
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7

A Bendable Microwave GaN HEMT on CVD Parylene-C Substrate:

, In: 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO),
Wang, Yan ; Dai, Wei ; Wu, Yunqiu... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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8

Experimental Investigations of Capacity Response of Root Pi..:

, In: Innovative Solutions for Deep Foundations and Retaining Structures; Sustainable Civil Infrastructures,
Li, Xiao-juan ; Dai, Guo-liang ; Gong, Wei-ming. - p. 18-39 , 2019
Link: https://doi.org/10.1007/..
 
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9

Upper Bound Solution for Ultimate Bearing Capacity of Sucti..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of China-Europe Conference on Geotechnical Engineering,
Zhu, Wen-bo ; Dai, Guo-liang ; Gong, Wei-ming. - p. 463-466 , 2018
Link: https://doi.org/10.1007/..
 
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10

Generalized Solutions for Lateral Bearing Behavior of Large..:

, In: New Developments in Materials for Infrastructure Sustainability and the Contemporary Issues in Geo-environmental Engineering; Sustainable Civil Infrastructures,
Zhu, Ming-Xing ; Lu, Hong-Qian ; Dai, Guo-Liang.. - p. 99-124 , 2018
Link: https://doi.org/10.1007/..
 
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11

Environmental monitoring via compressive sensing:

, In: Proceedings of the Sixth International Workshop on Knowledge Discovery from Sensor Data,
Yan, Shulin ; Wu, Chao ; Dai, Wei.. - p. 61-68 , 2012
Link: https://dl.acm.org/doi/1..
 
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12

List of contributors:

, In: Water Security: Big Data-Driven Risk Identification, Assessment and Control of Emerging Contaminants,
Abdelkarim, Esraa A. ; Ali, Sameh S. ; Al-Tohamy, Rania... - p. xvii-xxiv , 2024
Link: https://doi.org/10.1016/..
 
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13

Gate Oxide Failure Mechanisms of SiC MOSFET Related to Elec..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Ren, Min ; Liang, Shiqi ; Zhou, Tong... - p. 208-211 , 2024
Link: https://doi.org/10.1109/..
 
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14

Contributors:

, In: Human Reproductive and Prenatal Genetics,
Aggarwal, Vimla ; Barber, T.M. ; Becker, Christian M.... - p. xiii-xix , 2023
Link: https://doi.org/10.1016/..
 
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15

Investigation on Thermal Efficiency Enhancement and Trapped..:

, In: 2023 24th International Vacuum Electronics Conference (IVEC),
Han, Binyang ; Jiang, Wei ; Lu, Chaoxuan... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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