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Derakhshandeh, Jaber
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1

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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2

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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3

20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ji, Xinrui ; Du, Leiming ; van Zeijl, Henk... - p. 1891-1895 , 2024
Link: https://doi.org/10.1109/..
 
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4

Plasma Cleaning and Thermal Compression Bonding of Indium B..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kang, Kumin ; Derakhshandeh, Jaber ; Wendeln, Christian... - p. 267-268 , 2024
Link: https://doi.org/10.23919..
 
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5

Process Development and Characterization of Ru-based UBM fo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tulzo, Harold Le ; Bijou, Diane ; Souza, Therese... - p. 378-385 , 2024
Link: https://doi.org/10.1109/..
 
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6

Wet Cu passivation for high throughput fluxless Thermal Com..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Rip, Jens ; Derakhshandeh, Jaber ; Negishi, Ryo... - p. 1859-1862 , 2024
Link: https://doi.org/10.1109/..
 
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7

Process Challenges During CVD Oxide Deposition on the Backs..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Guerrero, Alice ; Salahouelhadj, Abdellah... - p. 1584-1589 , 2023
Link: https://doi.org/10.1109/..
 
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8

IP Session on Chiplet: Design, Assembly, and Test:

, In: 2023 IEEE 41st VLSI Test Symposium (VTS),
Vinnakota, Bapi ; Derakhshandeh, Jaber ; Beyne, Eric.. - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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9

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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10

Confined IMCs for low temperature and high throughput D2W b..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Derakhshandeh, Jaber ; La Tulipe, Douglas Charles ; Capuz, Giovanni... - p. 131-132 , 2022
Link: https://doi.org/10.23919..
 
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11

Fundamental study of IMC grains at low anneal temperature:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Gerets, Carine ; Derakhshandeh, Jaber ; Shafahian, Ehsan... - p. 133-134 , 2022
Link: https://doi.org/10.23919..
 
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12

Process development and characterization of 3D multi-die st..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Gerets, Carine ; Derakhshandeh, Jaber ; Bex, Pieter... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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13

A novel iso-thermal intermetallic compound insertion bondin..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hou, Lin ; Derakhshandeh, Jaber ; Capuz, Giovanni... - p. 1442-1447 , 2020
Link: https://doi.org/10.1109/..
 
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14

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Capuz, Giovanni ; Cherman, Vladimir... - p. 617-622 , 2020
Link: https://doi.org/10.1109/..
 
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15

Evaluation of UBM oxidation through air exposure and heatin..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Hossein Mirdamadi, S. ; Derakhshandeh, Jaber ; Cochet, Tom... - p. 1-8 , 2020
Link: https://doi.org/10.1109/..
 
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