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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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3D interconnects for quantum computing:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Plasma Cleaning and Thermal Compression Bonding of Indium B..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Process Development and Characterization of Ru-based UBM fo..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Wet Cu passivation for high throughput fluxless Thermal Com..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Process Challenges During CVD Oxide Deposition on the Backs..:
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2023 IEEE 41st VLSI Test Symposium (VTS) ,
8
IP Session on Chiplet: Design, Assembly, and Test:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Low temperature backside damascene processing on temporary ..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Confined IMCs for low temperature and high throughput D2W b..:
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2022 International Conference on Electronics Packaging (ICEP) ,
11
Fundamental study of IMC grains at low anneal temperature:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
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Process development and characterization of 3D multi-die st..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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A novel iso-thermal intermetallic compound insertion bondin..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
14
10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
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