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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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Application of a Multi-technique Fusion Approach on Fine Ch..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
2
Application of Development Seismic Key Technologies in Deep..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
3
Time-Lapse Seismic Matching Inversion Technology and Applic..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
4
Application of Seismic Sedimentology in Meandering River Ch..:
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Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering ,
5
A Case Study of Offshore Time-Lapse Seismic Technology in t..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2019 ,
6
Application of Non-repeated Time-Lapse Seismic Technology i..:
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Proceedings of the 2021 5th International Conference on Electronic Information Technology and Computer Engineering ,
7
Guaranteed Convergence Sine Cosine Algorithm:
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2019 14th Symposium on Piezoelectrcity, Acoustic Waves and Device Applications (SPAWDA) ,
8
Design and Simulation of High Flowrate Piezoelectric Pump b..:
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Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering ,
9
New Understanding of Hydrocarbon Accumulation in KN Area, M..:
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2020 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR) ,
10
10kW-level Yb-doped Aluminophosphosilicate Fiber:
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2022 IEEE International Test Conference (ITC) ,
11
Fault-coverage Maximizing March Tests for Memory Testing:
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2023 IEEE International Conference on Robotics and Automation (ICRA) ,
12
On Improving Boundary Quality of Instance Segmentation in C..:
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2023 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS) ,
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SDF-Pack: Towards Compact Bin Packing with Signed-Distance-..:
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2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) ,
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Bias Temperature Instability Analysis of Nanosheet Based SR..:
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