Gary Lin
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1

Delay-Matching Routing for Advanced Packages:

, In: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD),
Lee, Chun-An ; Liu, Wen-Hao ; Lin, Gary. - p. 1-8 , 2023
 
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2

Challenges for Automating Package Routing:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Liu, Wen-Hao ; Chen, Bing ; Chang, Hua-Yu.. - p. 193-194 , 2022
 
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4

Contributors:

, In: Avery's Diseases of the Newborn,
Abman, Steven H. ; Allegaert, Karel ; Arya, Bhawna... - p. vii-xx , 2018
 
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5

A Vendor-Buyer Supply Chain Model with an Imperfect Product..:

, In: Proceedings of the 2017 International Conference on E-Business and Internet,
Lin, Gary C. - p. 38-44 , 2017
 
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6

List of Contributors:

, In: Recent Highlights in the Discovery and Optimization of Crop Protection Products,
Abe, Y. ; Anspaugh, Douglas D. ; Aoki, Takao... - p. xiii-xxi , 2021
 
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7

BrainTracker: mHealth app for Remote Assessment of Pediatri..:

, In: 2020 IEEE 8th International Conference on Serious Games and Applications for Health (SeGAH),
Gary, Kevin ; Cole, Mason ; Purbey, Dipak... - p. 1-6 , 2020
 
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8

Airgap Integration on Patterned Metal Lines for Advanced In..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Chang, H.K. ; Huang, H.Y. ; Lo, T.Y... - p. 1-4 , 2023
 
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9

List of contributors:

, In: Genetic Steroid Disorders,
 
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10

List of contributors:

, In: Enzymes Beyond Traditional Applications in Dairy Science and Technology,
 
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11

Assessment of Axillary Nodes:

, In: Fine Needle Aspiration Cytology of the Breast,
Wong, Jill Su Lin ; Ho, Gay Hui ; Tse, Gary.. - p. 147-153 , 2023
 
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12

List of contributors:

, In: State of the Art in Neural Networks and Their Applications,
 
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13

A 3nm 256Mb SRAM in FinFET Technology with New Array Bankin..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chang, Jonathan ; Chen, Yen-Huei ; Chan, Gary... - p. 1-2 , 2023
 
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14

A Comprehensive Dataset of Grains for Granular Jamming in S..:

, In: 2023 IEEE International Conference on Soft Robotics (RoboSoft),
 
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15

Enhanced System Level Channel Characterization Methodology ..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Jimmy ; Wu, Kuan-Ting ; Ho, Brian... - p. 1-4 , 2022
 
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