Geßner, T
19  results:
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2

A new technology platform for fully integrated polymer base..:

, In: 4M 2006 - Second International Conference on Multi-Material Micro Manufacture,
Nestler, J. ; Hiller, K. ; Gessner, T.... - p. 35-38 , 2006
 
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3

Chemical vapor deposition of C-F low-k materials:

, In: Interlayer Dielectrics for Semiconductor Technologies,
Uhlig, M. ; Gessner, T. - p. 201-225 , 2003
 
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4

Spin-on Si-based low-k materials:

, In: Interlayer Dielectrics for Semiconductor Technologies,
Schulz, S.E. ; Gessner, T. - p. 227-259 , 2003
 
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5

TiN diffusion barriers for copper metalization:

, In: European Workshop Materials for Advanced Metallization,,
Baumann, J. ; Werner, T. ; Rennau, M... - p. 127 , 1997
 
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6

Mechanism studies of Cu RIE for VLSI interconnections:

, In: European Workshop Materials for Advanced Metallization,,
Markert, M. ; Bertz, A. ; Gessner, T. - p. 155,156,157 , 1997
 
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7

TIN/W double layers as a barrier system for use in Cu metal..:

, In: European Workshop Materials for Advanced Metallization,,
Baumann, J. ; Markert, M. ; Werner, T.... - p. 128,129 , 1997
 
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8

Stress in copper films for interconnects:

, In: European Workshop Materials for Advanced Metallization,,
Riedel, S. ; Rober, J. ; Schulz, S.E.. - p. 148,149 , 1997
 
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9

Influence of carrier gas on Cu nucleation, film properties ..:

, In: European Workshop Materials for Advanced Metallization,,
Rober, J. ; Riedel, S. ; Schulz, S.E.. - p. 25,26 , 1997
 
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10

MoSi2 FORMED BY ION IMPLANTATION THROUGH METAL CITIO TECHNI..:

, In: EPM '89: 3rd International Conference on Energy Pulse and Particle Beam Modification of Materials, September 4.–8. 1989, Dresden, GDR,
Vetter, E. ; Grünewald, W. ; Tolonics, J.. - p. 264-267 , 1989
 
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15

Methods and Technologies for Mastering Uncertainty:

, In: Springer Tracts in Mechanical Engineering; Mastering Uncertainty in Mechanical Engineering,
Groche, Peter ; Abele, Eberhard ; Al-Baradoni, Nassr... - p. 209-364 , 2021
 
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