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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
2
Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:
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2017 18th International Conference on Electronic Packaging Technology (ICEPT) ,
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The study on elastic properties of Cu3Sn under pressure via..:
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2017 18th International Conference on Electronic Packaging Technology (ICEPT) ,
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The electronic properties of zinc-blende GaN, wurtzite GaN ..:
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2019 18th International Conference on Optical Communications and Networks (ICOCN) ,
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High sensitivity biosensor for Staphylococcus Aureus detect..:
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2019 18th International Conference on Optical Communications and Networks (ICOCN) ,
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Ultrasensitive Microfiber Refractive Index Sensor Based on ..:
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2007 1st Asian and Pacific Conference on Synthetic Aperture Radar ,
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Motion compensation technique for high resolution spotlight..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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Anisotropic mechanical characteristics of Cu6Sn5 micro-cant..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
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The influence of phase inhomogeneity on the current density..:
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2008 International Conference on Electronic Packaging Technology & High Density Packaging ,
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Optimization of the fatigue life of Epoxy Molding Compounds..:
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2022 IEEE 4th Eurasia Conference on IOT, Communication and Engineering (ECICE) ,
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Develop an Intelligent Robotic Arm Grasp and Control System..:
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Proceedings of the 7th International Conference on Architecture, Materials and Construction; Lecture Notes in Civil Engineering ,
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Preliminary Design and Motion Response Analysis of VLFS:
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2024 9th International Conference on Computer and Communication Systems (ICCCS) ,
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Client Selection Method for Federated Learning Based on Gro..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
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