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Guo 郭, Xing-Dao 星导
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1

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Gui, Jun ; Li, Xing-Min ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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2

Tensile performance of line-type microscale Cu/Sn-58Bi/Cu j..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Li, Xing-Min ; Gui, Jun ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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3

The study on elastic properties of Cu3Sn under pressure via..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Niu, Fan-Fan ; Luan, Xing-He ; Feng, Chuang... - p. 1207-1211 , 2017
Link: https://doi.org/10.1109/..
 
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4

The electronic properties of zinc-blende GaN, wurtzite GaN ..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Luan, Xing-He ; Feng, Chuang ; Qin, Hong-Bo.. - p. 1483-1487 , 2017
Link: https://doi.org/10.1109/..
 
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5

High sensitivity biosensor for Staphylococcus Aureus detect..:

, In: 2019 18th International Conference on Optical Communications and Networks (ICOCN),
Chen, Ling ; Liu, Bin ; Liao, Yun-Cheng... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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6

Ultrasensitive Microfiber Refractive Index Sensor Based on ..:

, In: 2019 18th International Conference on Optical Communications and Networks (ICOCN),
Liao, Yun-Cheng ; Mao, Zhi-Qiang ; Liu, Bin... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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7

Motion compensation technique for high resolution spotlight..:

, In: 2007 1st Asian and Pacific Conference on Synthetic Aperture Radar,
Tang, Yu ; Xing, Meng-dao - p. None , 2007
Link: https://doi.org/10.1109/..
 
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8

Shear performance of microscale BGA structure Cu/Sn-3.0Ag-0..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Wang-Yun ; Peng, Guan-Qiang ; Cheng, Tian-Xiang... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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9

Anisotropic mechanical characteristics of Cu6Sn5 micro-cant..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Kuang, Tian-Feng ; Qin, Hong-Bo ; Li, Wang-Yun. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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10

The influence of phase inhomogeneity on the current density..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Wen, Quan-Zhang ; Guo, Lei ; Qin, Hong-Bo.. - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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11

Optimization of the fatigue life of Epoxy Molding Compounds..:

, In: 2008 International Conference on Electronic Packaging Technology & High Density Packaging,
Cai, Miao ; Yang, Dao-guo ; Li, Quan-yong. - p. None , 2008
Link: https://doi.org/10.1109/..
 
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12

Develop an Intelligent Robotic Arm Grasp and Control System..:

, In: 2022 IEEE 4th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Hu, Nian-Ze ; Lin, Qi-Ren ; Wu, Ruo-Wei... - p. 582-584 , 2022
Link: https://doi.org/10.1109/..
 
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13

Preliminary Design and Motion Response Analysis of VLFS:

, In: Proceedings of the 7th International Conference on Architecture, Materials and Construction; Lecture Notes in Civil Engineering,
Luo, Zhao ; Wu, Qi-He ; Feng, Xian-Dao. - p. 3-8 , 2022
Link: https://doi.org/10.1007/..
 
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14

Client Selection Method for Federated Learning Based on Gro..:

, In: 2024 9th International Conference on Computer and Communication Systems (ICCCS),
Li, Guo-ming ; Liu, Wai-xi ; Guo, Zhen-zheng. - p. 327-332 , 2024
Link: https://doi.org/10.1109/..
 
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15

Study on Gas Accumulation Assemblage and Main Controlling F..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022,
Wang, Yu-xia ; Huang, Dao-jun ; Zhou, Li-fa... - p. 1260-1275 , 2023
Link: https://doi.org/10.1007/..
 
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