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2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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New WLCSP scheme for device reliability improvement: YE: Yi..:
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Reference Module in Materials Science and Materials Engineering ,
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Discotic Liquid Crystals (DLCs): Overview:
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IET International Conference on Frontier Computing. Theory, Technologies and Applications ,
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A new non-expansion visual cryptography scheme with high qu..:
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2007 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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New Recursive Adaptive Beamforming Algorithms for Uniform C..:
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International 1989 Joint Conference on Neural Networks ,
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Pattern classifier net using information entropy:
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Lecture Notes in Mathematics; Nonlinear Semigroups, Partial Differential Equations and Attractors ,
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On the integrability of nonlinear evolution equations:
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Recent Trends in Cold-Formed Steel Construction ,
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Recent development of building codes and design standards f..:
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13th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2023) ,
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Reliability assessment of machine tool spindle systems with..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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FeRAM Recovery up to 200 Periods with Accumulated Endurance..:
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13th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2023) ,
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Reliability allocation of CNC machine tools based on AHP-en..:
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Proceedings of the 28th International Cryogenic Engineering Conference and International Cryogenic Materials Conference 2022; Advanced Topics in Science and Technology in China ,
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Experimental Investigation of Controlling Piston Offset in ..:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
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Study of 13N High Purity Germanium Detectors with amorphous..:
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2023 Optical Fiber Communications Conference and Exhibition (OFC) ,
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Mode-Group-Division Multiplexing over a Deployed 15-Mode-Fi..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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