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Han, Yi-Neng
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1

Investigation of Low Temperature Co-Co Direct Bonding and C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liu, Demin ; Mei, Kuan-Chun ; Hu, Han-Wen... - p. 187-193 , 2022
Link: https://doi.org/10.1109/..
 
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2

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Zhang, Jie ; Lu, Wei ; Huang, Po-Tsang... - p. 262-263 , 2022
Link: https://doi.org/10.1109/..
 
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3

Advanced 2.5D Heterogeneous Integrated Platform Using Flexi..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Ku, Shu-Yun ; Tsai, Yi-Chieh ; Chou, Tzu-Chieh... - p. 1020-1025 , 2021
Link: https://doi.org/10.1109/..
 
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4

Fluorescent Immunosensing Enhanced with a Bead-based Optoel..:

, In: 2019 IEEE 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
Chuang, Han-Sheng ; Lin, Hsiao-Neng ; Wang, Jen-Yi - p. 130-134 , 2019
Link: https://doi.org/10.1109/..
 
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5

Alice in Gravityland: Augmenting Gravity Experiences with A..:

, In: ACM SIGGRAPH 2023 Immersive Pavilion,
Taglialatela, Luca E. ; Chang, Chiao-Ju ; Chen, Shu-Wen... - p. 1-2 , 2023
Link: https://dl.acm.org/doi/1..
 
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6

Clip-on gadgets : expanding multi-touch interaction area..:

, In: Proceedings of the 24th annual ACM symposium on User interface software and technology,
Yu, Neng-Hao ; Tsai, Sung-Sheng ; Hsiao, I-Chun... - p. 367-372 , 2011
Link: https://dl.acm.org/doi/1..
 
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7

Development and Future Direction of Unmanned System Based o..:

, In: Lecture Notes in Electrical Engineering; Advances in Guidance, Navigation and Control,
Li, Fangdong ; Zeng, Qinghua ; Xiong, Zhi.. - p. 7152-7161 , 2023
Link: https://doi.org/10.1007/..
 
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8

Experiment and Simulation for Normal Zone Propagation Inser..:

, In: 2023 IEEE International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD),
Chen, Huang ; Wang, Kai-Song ; Hua, Kai... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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9

LC Resonant Battery Equalizer:

, In: 2019 IEEE 4th International Future Energy Electronics Conference (IFEEC),
Chen, Liang-Rui ; Chen, Bo-Hong ; Hsu, Cheng-Hung... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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10

Techno-Economic Feasibility of Off-Grid Renewable Energy Sy..:

, In: IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society,
Liang, Yingqi ; Saner, Can Berk ; Lee, Noven... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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11

Flex Force Smart Glove for Therapy Treatment Using Arduino ..:

, In: Lecture Notes in Mechanical Engineering; Intelligent Manufacturing and Mechatronics,
Neng, Chang Yi ; Ishak, Mohamad Khairi ; Ahmarofi, Ahmad Afif - p. 511-523 , 2021
Link: https://doi.org/10.1007/..
 
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12

Investigations into the Effects of Microcystin-LR on the Gr..:

, In: 2010 4th International Conference on Bioinformatics and Biomedical Engineering,
Xue, Yanfeng ; Li, Youqin ; Shi, Zhiqi.. - p. 1-5 , 2010
Link: https://doi.org/10.1109/..
 
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13

Application of Deep Shear Wave Imaging in Evaluation of Nea..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022,
Zhang, Cheng-sen ; Wu, Xing-neng ; Duan, Wen-xing... - p. 365-379 , 2023
Link: https://doi.org/10.1007/..
 
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14

Legal Events Classification in Online Social Community Post:

, In: 2023 IEEE 23rd International Conference on Software Quality, Reliability, and Security Companion (QRS-C),
Liu, Yi-Hung ; Feng, Yin-Neng ; Chen, Sheng-Fong - p. 350-355 , 2023
Link: https://doi.org/10.1109/..
 
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15

Emerging Memory RRAM Embedded in 12FFC FinFET Technology fo..:

, In: 2023 International Electron Devices Meeting (IEDM),
Wu, Chun-Yu ; Yang, Chang-Feng ; Lai, Chih-Wei... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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