Ho, Hsin-En
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1

Not Merely Deemed as Distraction: Investigating Smartphone ..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
Chang, Xi-Jing ; Hsu, Fang-Hsin ; Liang, En-Chi... - p. 1-17 , 2023
 
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2

Nearly Ideal Subthreshold Swing in Monolayer MoS₂ Top-Gate ..:

, In: 2022 International Electron Devices Meeting (IEDM),
Lee, Tsung-En ; Su, Yuan-Chun ; Lin, Bo-Jiun... - p. 7.4.1-7.4.4 , 2022
 
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3

Investigation on Diffferent Buffer to Supress the RF-Loss i..:

, In: 2019 IEEE 4th International Future Energy Electronics Conference (IFEEC),
 
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4

Path-Diversity-Aware Adaptive Routing in Network-on-Chip Sy..:

, In: 2012 IEEE 6th International Symposium on Embedded Multicore SoCs,
Kuo, Yu-Hsin ; Tsai, Po-An ; Ho, Hao-Ping... - p. 175-182 , 2012
 
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5

Sharing and Experiencing Hardware and Methods to Advance Sm..:

, In: Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems,
 
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6

Microfabricated Isothermal Eg-Fet Sensor For Lamp Mediated ..:

, In: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS),
Ho, Hsin-Ying ; Kao, Wei-Sin ; Deval, Piyush.. - p. 448-451 , 2023
 
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7

Demonstration of High Voltage (>2KV) GaN-on-QST power MIS-H..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
Liu, Chia-Wei ; Liu, Yen-Wei ; Ho, Hsin-Jou. - p. 1-2 , 2023
 
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9

Incorporating Thermal Feedback in Cutaneous Displays: Recon..:

, In: Haptic and Audio Interaction Design; Lecture Notes in Computer Science,
Jones, Lynette A. ; Ho, Hsin-Ni - p. 48-58 , 2022
 
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10

An Optical pH Sensor with Second Layer to Eliminate Leachin..:

, In: 2020 Opto-Electronics and Communications Conference (OECC),
 
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11

A Study on the User Cognitive Model of Learning Management ..:

, In: Lecture Notes in Electrical Engineering; Frontier Computing,
Ho, Hsin-Chao ; Wang, Mong-Te ; Shih, Shu-Chuan.. - p. 193-202 , 2019
 
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12

Transient Thermal Resistance Analysis for IC Packages:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Chen, Hsin-En ; Yang, Penny ; Hu, Ian... - p. 1-4 , 2019
 
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13

Novel Thermal Model Development for System Level Thermal Pe..:

, In: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Hsin-En ; Shih, Meng-Kai ; Tarng, David. - p. 93-96 , 2018
 
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14

Design and Analysis of Metric Bolted Joints:

, In: Metal Fatigue Analysis Handbook,
Lee, Yung-Li ; Ho, Hsin-Chung - p. 461-513 , 2012
 
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15

Dynamic Droop Scaling for Improving Current Sharing Perform..:

, In: 2007 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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