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Ho, Tzu-Hao
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1

Investigation of Induced EFT Transient Noise and Effect on ..:

, In: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),
Lin, Han-Nien ; Ho, Tzu-Hao ; Syu, Wan-Yu... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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2

Analysis of Capacitive Clamp Effect on Power Charging Cords..:

, In: 2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),
Lin, Han-Nien ; Ho, Tzu-Hao ; Syu, Wan-Yu... - p. 248-251 , 2022
Link: https://doi.org/10.1109/..
 
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3

Switching Noise Analysis for Conducted Electromagnetic Inte..:

, In: 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC),
Lin, Han-Nien ; Ho, Tzu-Hao ; Ko, Po-Ning... - p. 1-4 , 2021
Link: https://doi.org/10.1109/..
 
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4

EFT Transient Noise Model and Protection Analysis from Chip..:

, In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
Lin, Han-Nien ; Ho, Tzu-Hao ; Huang, Yu-Chun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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5

Design and Characteristic Calibration of TEM Cell for IC Ra..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Ho, Tzu-Hao ; Lin, Han-Nien ; Ko, Po-Ning... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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6

Analysis of PCB return path configuration effect on Transie..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Lin, Han-Nien ; Huang, Jia-Yu ; Huang, Yu-Chun... - p. 214-217 , 2019
Link: https://doi.org/10.23919..
 
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7

Establishment of ESD Generator Model for Transient Suscepti..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Lin, Han-Nien ; Ko, Bo-Ning ; Lin, Jeffrey Yen-Ting... - p. 209-212 , 2019
Link: https://doi.org/10.23919..
 
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8

Root Cause Analysis and Defect Ground Effect of EMI Problem..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Lin, Han-Nien ; Tseng, Wei-Ding ; Wu, Cheng-Hau.. - p. 440-443 , 2019
Link: https://doi.org/10.23919..
 
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9

High-Sensitivity Magnetic Probe Design on EMI Measurement f..:

, In: 2019 Electrical Design of Advanced Packaging and Systems (EDAPS),
Ho, Tzu-Hao ; Lin, Han-Nien ; Tseng, Wei-Ding.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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10

Zero-LEINR: Zero-Reference Low-light Image Enhancement with..:

, In: 2023 IEEE International Symposium on Circuits and Systems (ISCAS),
Tang, Wing Ho ; Yuan, Hsuan ; Chiang, Tzu-Hao. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

An Efficient CKKS-FHEW/TFHE Hybrid Encrypted Inference Fram..:

, In: Computer Security. ESORICS 2023 International Workshops; Lecture Notes in Computer Science,
Liu, Tzu-Li ; Ku, Yu-Te ; Ho, Ming-Chien... - p. 535-551 , 2024
Link: https://doi.org/10.1007/..
 
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12

Plasmon-Enhanced Solar-Driven Hydrogen Evolution Using Plas..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Peng, Tzu-Yu ; Yu, Meng-Ju ; Chang, Chih-Li... - p. 1-1 , 2022
Link: https://doi.org/10.1109/..
 
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13

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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14

Cu Nanoparticle Sintering by Electrical Current:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wu, Albert T. ; Sheng, Tzu-Hao ; Chao, Jui-Lin.. - p. 107-108 , 2024
Link: https://doi.org/10.23919..
 
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15

Application of Mobilenetv3 for Detecting Resin Overflow Def..:

, In: Advances in Networked-based Information Systems; Lecture Notes on Data Engineering and Communications Technologies,
Chang, Chuan-Yu ; Chuang, Min-Yen ; Su, You-Da. - p. 393-402 , 2023
Link: https://doi.org/10.1007/..
 
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