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Ho, Wen-Hsien
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1

Worksite injury prevention through automatic mental fatigue..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Chen, Yenming J. ; Ho, Wen-Hsien - p. 101-102 , 2023
Link: https://doi.org/10.1109/..
 
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2

Artificial Neural Network Model for Predicting 5-year Morta..:

, In: 2012 Third International Conference on Innovations in Bio-Inspired Computing and Applications,
Hung, Wan-Ting ; Lee, King-Teh ; Wang, Shih-Chin... - p. 241-245 , 2012
Link: https://doi.org/10.1109/..
 
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3

An Optical pH Sensor with Second Layer to Eliminate Leachin..:

, In: 2020 Opto-Electronics and Communications Conference (OECC),
Ho, Hsin-Hsien ; Dang, Huu-Phuoc ; Chen, Yen-Chi... - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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4

A New Asynchronous Pipeline Template for Power and Performa..:

, In: Proceedings of the 51st Annual Design Automation Conference,
Ho, Kuan-Hsien ; Chang, Yao-Wen - p. 1-6 , 2014
Link: https://dl.acm.org/doi/1..
 
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5

Coupling-aware length-ratio-matching routing for capacitor ..:

, In: Proceedings of the 50th Annual Design Automation Conference,
Ho, Kuan-Hsien ; Ou, Hung-Chih ; Chang, Yao-Wen. - p. 1-6 , 2013
Link: https://dl.acm.org/doi/1..
 
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6

TRECO : dynamic technology remapping for timing engineer..:

, In: Proceedings of the 2010 Asia and South Pacific Design Automation Conference,
Ho, Kuan-Hsien ; Jiang, Jie-Hong R. ; Chang, Yao-Wen - p. 331-336 , 2010
Link: https://dl.acm.org/doi/1..
 
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7

High variation-tolerant obstacle-avoiding clock mesh synthe..:

, In: Proceedings of the International Conference on Computer-Aided Design,
Shih, Xin-Wei ; Lee, Hsu-Chieh ; Ho, Kuan-Hsien. - p. 452-457 , 2010
Link: https://dl.acm.org/doi/1..
 
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8

Routing for chip-package-board co-design considering differ..:

, In: Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design,
Fang, Jia-Wei ; Ho, Kuan-Hsien ; Chang, Yao-Wen - p. 512-517 , 2008
Link: https://dl.acm.org/doi/1..
 
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9

A Study of JEDEC Board-Level Drop Test Performance Predicti..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Cheng, Chi-Min ; Chao, Hsi-Wei ; Yen, Chu-Chiao... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

A Cost-efficient Hardware Accelerator Design for 2D Sliding..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Juang, Wen-Ho ; Wu, Meng-Chang ; Sheu, Yung-Hoh.. - p. 595-596 , 2023
Link: https://doi.org/10.1109/..
 
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11

Reshaping System Design in 3D Integration : Perspectives..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Chen, Hung-Ming ; Ho, Chu-Wen ; Wu, Shih-Hsien... - p. 71-77 , 2023
Link: https://dl.acm.org/doi/1..
 
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12

Evaluating the Sustainability of Non-urban Land Development..:

, In: Lecture Notes in Mechanical Engineering; The 10th International Conference on Engineering, Project, and Production Management,
Yu, Wen-Der ; Ho, Wei-Cheng ; Cheng, Shao-Tsai. - p. 3-19 , 2020
Link: https://doi.org/10.1007/..
 
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13

Temperature-insensitive Mach-Zehnder interferometer filters..:

, In: 2024 IEEE Silicon Photonics Conference (SiPhotonics),
Chen, Li-Yu ; Chen, Yong-Jun ; Huang, Wen-Hsien. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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14

Revisiting Fourier Domain Adaptation for Medical Image Segm..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Liu, Kuan-Fu ; Chen, Yie-Tarng ; Fang, Wen-Hsien. - p. 442-444 , 2024
Link: https://doi.org/10.1109/..
 
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15

Sustainable Fisheries Under Net-Zero Emissions: A Case Stud..:

, In: Springer Climate; Moving Toward Net-Zero Carbon Society,
Ho, Ching-Hsien ; Lee, Kuanting - p. 91-105 , 2023
Link: https://doi.org/10.1007/..
 
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