I agree that this site is using cookies. You can find further informations here.
X
Hou, Bin
216  results:
Bookchapter (Online) X
Search for persons X
?
1

A CNN-BiLSTM Method Based on Attention Mechanism for Class-..:

, In: Proceedings of the International Conference on Computer Vision and Deep Learning,
Yin, Jiali ; Hou, Bin ; Dai, Jiapeng. - p. 1-6 , 2024
Link: https://dl.acm.org/doi/1..
 
?
2

Enhancement-mode AlGaN/GaN HEMTs with a semi-wraparound met..:

, In: 2022 10th International Symposium on Next-Generation Electronics (ISNE),
Jia, Mao ; Hou, Bin ; Jia, Fu-Chun... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
3

An Exploratory Study to Achieve Cu Bump Bonding Structures ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Li-Ping ; Zhou, Min-Bo ; Hou, Bin.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
?
4

An Abnormal Behavior Recognition System of Equipment Delive..:

, In: 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP),
Liu, Zhiwei ; Hou, Bin ; Ning, Ke... - p. 417-421 , 2023
Link: https://doi.org/10.1109/..
 
?
5

Research on Multi-stage Proactive Defense Strategy against ..:

, In: 2023 IEEE 6th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE),
Hou, Bin ; Feng, Shiying ; Wang, Baoli... - p. 309-313 , 2023
Link: https://doi.org/10.1109/..
 
?
6

Record Power Performance of 33.1 W/mm with 62.9% PAE at X-b..:

, In: 2023 International Electron Devices Meeting (IEDM),
Yang, Ling ; Jia, Fuchun ; Lu, Hao... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
?
7

High Linearity AlGaN/GaN/Graded AlGaN/GaN Double Channel HE..:

, In: 2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
Yu, Qian ; Shi, Chunzhou ; Yang, Ling... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
8

Large-area Die Attachment and the Surface Finish Effect on ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Chun-Meng ; Hou, Bin ; Deng, Yun-Kai.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
?
9

High-performance Thin-barrier InGaN Channel DH-HEMT for Mil..:

, In: 2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),
Lu, Hao ; Deng, Longge ; Zhou, Likun... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
?
10

A Wafer-on-Wafer Non-Uniform High Power Thermal Model for 3..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Wang, Song ; Jiang, Xiping ; Zuo, Fengguo... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
?
11

Fabrication of wearable strain sensor by using a novel hybr..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gan, Cong ; Huang, Hai-Jun ; Hou, Bin.. - p. 801-806 , 2022
Link: https://doi.org/10.1109/..
 
?
12

Dynamic RAN Slicing with Effective Isolation under Imperfec..:

, In: 2022 IEEE 5th International Conference on Computer and Communication Engineering Technology (CCET),
Zhang, Jian ; Zu, Yunxiao ; Zhang, Yong. - p. 238-242 , 2022
Link: https://doi.org/10.1109/..
 
?
13

First Demonstration of High PAE Performance Using InGaN Cha..:

, In: 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA),
Lu, Hao ; Zhou, Likun ; Deng, Longge... - p. 30-31 , 2022
Link: https://doi.org/10.1109/..
 
?
14

Superb sinterability of the Cu paste consisting of bimodal ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hou, Bin ; Huang, Hai-Jun ; Wang, Chun-Meng.. - p. 2064-2070 , 2022
Link: https://doi.org/10.1109/..
 
?
15

The Improvement Breakdown Voltage of GaN on Si Pin Diode by..:

, In: 2022 IEEE 2nd International Conference on Computer Systems (ICCS),
Jia, Fuchun ; Chang, Qingyuan ; Chen, Xiaosheng... - p. 136-139 , 2022
Link: https://doi.org/10.1109/..
 
1-15