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Hsiao, Chih-Kun
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1

Design and Development of a Prototype Upper-limb Rehabilita..:

, In: 2023 9th International Conference on Automation, Robotics and Applications (ICARA),
Sung, Hsiu-Hsien ; Hsiao, Chih-Kun ; Lee, Cheng-Kang. - p. 123-127 , 2023
Link: https://doi.org/10.1109/..
 
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2

Design of an Efficient Deep Neural Network Accelerator Base..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Hsiao, Shen-Fu ; Lin, Sin-Chen ; Chen, Guan-Lin... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Neural Network Acceleration Using Digit-Plane Computation w..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Hsiao, Shen-Fu ; Kuo, Hou-Chun ; Kuo, Yu. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

Hardware Accelerator for MobileViT Vision Transformer with ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Hsiao, Shen-Fu ; Chao, Tzu-Hsien ; Yuan, Yen-Che. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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5

Using the Concept of Generative Adversarial Network (GAN) t..:

, In: Proceedings of the 2023 7th International Conference on Medical and Health Informatics,
Jen, Chih-Hung ; Fan, Shu-Kai S. ; Lu, Kun-Mu... - p. 297-302 , 2023
Link: https://dl.acm.org/doi/1..
 
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6

Collaborative voltage scaling with online STA and variable-..:

, In: Proceedings of the 20th symposium on Great lakes symposium on VLSI,
Lin, Tay-Jyi ; Hsiao, Pi-Cheng ; Lin, Chi-Hung... - p. 347-352 , 2010
Link: https://dl.acm.org/doi/1..
 
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7

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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8

A Wireless Power Transfer IoT Electronic Flower Pot System ..:

, In: 2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM),
Hsiao, Chih-Lung ; Liu, Sheng-Feng ; Yang, Chih-Fu. - p. 10-13 , 2023
Link: https://doi.org/10.1109/..
 
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9

Warpage Assessment of System in Wafer-level Package Technol..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Yu, Ching-Feng ; Hsu, Chao-Kai ; Hsiao, Chih-Cheng - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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10

FOODwell:

, In: Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems,
Hsieh, An-Ting ; Hsiao, Chih-Ching ; Tsai, Hsin-Hua.. - p. 1-6 , 2023
Link: https://dl.acm.org/doi/1..
 
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11

Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embed..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kobinata, Kyosuke ; Funaki, Tatsuya ; Satake, Yoshiaki... - p. 385-386 , 2022
Link: https://doi.org/10.1109/..
 
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12

Functional Interposer Embedded with Multi-Terminal Si Capac..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Satake, Yoshiaki ; Funaki, Tatsuya ; Kobinata, Kyosuke... - p. 283-288 , 2022
Link: https://doi.org/10.1109/..
 
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13

The Relationships Among Perceived Severity of Negative Publ..:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; Smart Grid and Internet of Things,
Hsiao, Chih-Hu ; Chen, Kuan-Yang - p. 403-413 , 2021
Link: https://doi.org/10.1007/..
 
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14

An Implementation and Development of Distributed Visualized..:

, In: 2021 IEEE 3rd Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability (ECBIOS),
Tsao, Yung-Chung ; Kuo, Yaw-Wen ; Hsiao, Chih-Jen.. - p. 152-155 , 2021
Link: https://doi.org/10.1109/..
 
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15

Comparison of Different Information Display Modes for Smart..:

, In: Communications in Computer and Information Science; HCI International 2020 – Late Breaking Posters,
Wang, Chao-Hung ; Hsiao, Chih-Yu ; Tai, An-Ting. - p. 238-243 , 2020
Link: https://doi.org/10.1007/..
 
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