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Hsiao, Chin-Yu
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1

Semi-classical Spectral Asymptotics of Toeplitz Operators o..:

, In: The Bergman Kernel and Related Topics; Springer Proceedings in Mathematics & Statistics,
Hsiao, Chin-Yu ; Marinescu, George - p. 239-259 , 2024
Link: https://doi.org/10.1007/..
 
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2

When AI Meets AI - Artificial Intelligence Competition:

, In: 2023 11th International Conference on Information and Education Technology (ICIET),
Chen, Rain ; Hsiao, Yu-Chin ; Yang, Mei-Wei - p. 497-501 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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4

Industry 4.0 Approaches for Supply Chains Facing COVID-19: ..:

, In: Advances in Intelligent Systems and Computing; Intelligent Computing and Optimization,
Reong, Samuel ; Wee, Hui-Ming ; Hsiao, Yu-Lin. - p. 1242-1251 , 2021
Link: https://doi.org/10.1007/..
 
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5

On-chip optical interconnects integrated with laser and pho..:

, In: OFC 2014,
Po-Kuan Shen ; Chin-Ta Chen ; Chia-Hao Chang... - p. 1-3 , 2014
Link: https://doi.org/10.1364/..
 
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6

Combination of feature engineering and ranking models for p..:

, In: Proceedings of the 2013 KDD Cup 2013 Workshop,
Li, Chun-Liang ; Su, Yu-Chuan ; Lin, Ting-Wei... - p. 1-7 , 2013
Link: https://dl.acm.org/doi/1..
 
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7

Effective string processing and matching for author disambi..:

, In: Proceedings of the 2013 KDD Cup 2013 Workshop,
Chin, Wei-Sheng ; Juan, Yu-Chin ; Zhuang, Yong... - p. 1-9 , 2013
Link: https://dl.acm.org/doi/1..
 
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8

Emerging Epidemics of Arseniasis in Asia:

, In: Arsenic Exposure and Health Effects III,
Chen, Chien-Jen ; Hsu, Lin-I ; Tseng, Chin-Hsiao.. - p. 113-121 , 1999
Link: https://doi.org/10.1016/..
 
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9

MMW Receiver Front-End for Noninvasive Glucose Measurement:

, In: 2019 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS),
Yen, Ming-Yu ; Zhou, Fang-Yu ; Chang, Wen-Ling. - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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10

New Circuit Topology for System-Level Reliability of GaN:

, In: 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Lin, Ming-Cheng ; Chang, Wen-Che ; Wu, Haw-Yun... - p. 299-302 , 2019
Link: https://doi.org/10.1109/..
 
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11

53.5625 Gb/s X 4-ch Optical Interconnect Module Based on Si..:

, In: 2019 IEEE CPMT Symposium Japan (ICSJ),
Chen, Chin-Ta ; Lan, Hsiao-Chin ; Shen, Po-Kuan... - p. 209-211 , 2019
Link: https://doi.org/10.1109/..
 
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12

Chip-level 10-Gbit/s optical interconnects using 1 × 2 poly..:

, In: OFC 2014,
Chen, Chin-Ta ; Shen, Po-Kuan ; Teng-Zhang Zhu... - p. 1-3 , 2014
Link: https://doi.org/10.1364/..
 
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13

Palette-Based Colorization for Vector Icons:

, In: ACM SIGGRAPH 2023 Posters,
Lin, Miao ; Shen, I-Chao ; Chin, Hsiao-Yuan.. - p. 1-2 , 2023
Link: https://dl.acm.org/doi/1..
 
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14

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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15

Design and Development of a Prototype Upper-limb Rehabilita..:

, In: 2023 9th International Conference on Automation, Robotics and Applications (ICARA),
Sung, Hsiu-Hsien ; Hsiao, Chih-Kun ; Lee, Cheng-Kang. - p. 123-127 , 2023
Link: https://doi.org/10.1109/..
 
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