Hsiao, Hao-Ming
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1

Modeling a Cannula Insertion into a Phantom of Biological T..:

, In: New Trends in Mechanism and Machine Science; Mechanisms and Machine Science,
Dosaev, Marat ; Goryacheva, Irina ; Ju, Ming-Shaung... - p. 198-205 , 2020
 
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2

Statistical Analysis of Bit-Errors Distribution for Reliabi..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Wang, Nian-Jia ; Lee, Kuan-Yi ; Lin, Hsin-Yi... - p. 1-5 , 2020
 
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3

Contributors:

, In: Braddom's Rehabilitation Care: A Clinical Handbook,
 
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4

Intention-focused active reranking for image object retriev..:

, In: Proceedings of the 18th ACM conference on Information and knowledge management,
Hsiao, Jen-Hao ; Chen, Ming-Syan - p. 157-166 , 2009
 
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5

Enhancing the Energy Efficiency of Journaling File System v..:

, In: Proceedings of the International Symposium on Low Power Electronics and Design,
 
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6

Deep Recognition of Facial Expressions in Movies:

, In: 2022 International Conference on Technologies and Applications of Artificial Intelligence (TAAI),
 
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7

Combination of feature engineering and ranking models for p..:

, In: Proceedings of the 2013 KDD Cup 2013 Workshop,
Li, Chun-Liang ; Su, Yu-Chuan ; Lin, Ting-Wei... - p. 1-7 , 2013
 
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8

Effective string processing and matching for author disambi..:

, In: Proceedings of the 2013 KDD Cup 2013 Workshop,
Chin, Wei-Sheng ; Juan, Yu-Chin ; Zhuang, Yong... - p. 1-9 , 2013
 
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9

Trees Detection on Google Street View Images Using Deep Lea..:

, In: Advances in Intelligent Systems and Computing; Advances in Artificial Intelligence,
Chen, Lieu-Hen ; Hung, Hao-Ming ; Sun, Cheng-Yu... - p. 236-243 , 2020
 
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10

An Advanced Packaging Figure of Merit (AP-FoM) for Benchmar..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Chuei-Tang ; Shang, Shu-An ; Hsiao, Yu-Ming... - p. 1093-1097 , 2024
 
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11

FastTuner: Transferable Physical Design Parameter Optimizat..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
 
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12

Signal and Power Integrity Performance of CoWoS-R in Chiple..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Wang, Chuei-Tang ; Shang, Shu-An ; Hsiao, Yu-Ming... - p. 296-301 , 2023
 
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13

DREAM-GAN : Advancing DREAMPlace towards Commercial-Qual..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Lu, Yi-Chen ; Ren, Haoxing ; Hsiao, Hao-Hsiang. - p. 141-148 , 2023
 
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14

A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Co..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Wu, Ping-Chun ; Su, Jian-Wei ; Hong, Li-Yang... - p. 126-128 , 2023
 
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15

A 28nm 1Mb Time-Domain Computing-in-Memory 6T-SRAM Macro wi..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Wu, Ping-Chun ; Su, Jian-Wei ; Chung, Yen-Lin... - p. 1-3 , 2022
 
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