Hsieh, Amy I.
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1

Contributors:

, In: Braddom's Physical Medicine and Rehabilitation,
 
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2

Analysis, Simulation and Design of Soft-Switching Mechanism..:

, In: 2019 IEEE 4th International Future Energy Electronics Conference (IFEEC),
 
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3

Low voltage high speed SiO/sub 2/AlGaN/AlLaO/sub 3/TaN memo..:

, In: IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.,
Chin, A. ; McAlister, S.P. ; Chi, C.C.... - p. 158-161 , 2005
 
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4

Accelerated dark current degradation study of monolithicall..:

, In: 49th European Conference on Optical Communications (ECOC 2023),
Hsieh, P.-Y. ; Panda, D. P. ; Tsiara, A.... - p. None , 2023
 
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5

How Fault-Tolerant Quantum Computing Benefits from Cryo-CMO..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chiang, H.-L. ; Hadi, R. A. ; Wang, J.-F.... - p. 1-2 , 2023
 
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6

List of Contributors:

, In: Plastic Surgery - Principles and Practice,
 
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7

A 3nm CMOS FinFlex™ Platform Technology with Enhanced Power..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wu, Shien-Yang ; Chang, C.H. ; Chiang, M.C.... - p. 27.5.1-27.5.4 , 2022
 
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8

Integrated Robotic System for the Development Lateral Flow ..:

, In: 2019 IEEE Global Humanitarian Technology Conference (GHTC),
 
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9

Contributors:

, In: The Molecular Basis of Cancer,
 
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10

Use of Skin Biopsy in the Diagnosis of Small Fibre Neuropat..:

, In: European Handbook of Neurological Management,
Lauria, G. ; Hsieh, S. T. ; Johansson, O.... - p. 81-90 , 2010
 
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11

A 28nm Nonvolatile AI Edge Processor using 4Mb Analog-Based..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wen, Tai-Hao ; Hung, Je-Min ; Hsu, Hung-Hsi... - p. 1-2 , 2023
 
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12

List of contributors:

, In: Translational Radiation Oncology,
Aaron, Daniel ; Abrams, Ross A. ; Agarwal, Mohit S.... - p. xi-xvi , 2023
 
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13

A Low-Cost Antenna-in-Package (AiP) for D-Band Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Hung-Chun ; Wu, Po-I ; Jhong, Ming-Fong.. - p. 481-486 , 2023
 
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14

Contributors:

, In: Robotic and Navigated Spine Surgery,
 
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15

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passiva..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hong, Zhong-Jie ; Liu, Demin ; Hsieh, Shu-Ting... - p. 387-388 , 2022
 
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