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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Ultra High Density Package Design and Electrical Analysis i..:
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
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The Comparison of Package Design and Electrical Analysis in..:
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2019 IEEE CPMT Symposium Japan (ICSJ) ,
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High Density IO Fan-out Design Optimization with Signal Int..:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
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On the Importance of Neural Wiener Filter for Resource Effi..:
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ICASSP 2022 - 2022 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
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Speech Recovery For Real-World Self-Powered Intermittent De..:
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2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC) ,
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Autoencoder-Enhanced Federated Learning with Reduced Overhe..:
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2023 VTS Asia Pacific Wireless Communications Symposium (APWCS) ,
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Model Pruning for Wireless Federated Learning with Heteroge..:
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Proceedings of the 16th Asia and South Pacific Design Automation Conference ,
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TurboVG : a HW/SW co-designed multi-core openVG accelera..:
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Proceedings of the 2nd Asian Conference on Pattern Languages of Programs ,
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Emerging patterns of continuous integration for cross-platf..:
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Proceedings of the 6th International Wireless Communications and Mobile Computing Conference ,
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A dead-end free deployment algorithm for wireless sensor ne..:
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Proceedings of the 2005 Asia and South Pacific Design Automation Conference ,
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A configurable AES processor for enhanced security:
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2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC) ,
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