Hsieh, Wen-Ming
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1

Two-Dimensionally Arranged Display Drivers Achieved by OS/S..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Komura, Yusuke ; Miyata, Shoki ; Okamoto, Yuki... - p. 1-2 , 2023
 
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2

EMS-RTC: LSTM-based Adaptive Video Streaming for Smart Ambu..:

, In: 2023 IEEE Vehicular Networking Conference (VNC),
 
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3

Style and Color Design of Technology Packaging:

, In: Advances in Industrial Design; Advances in Intelligent Systems and Computing,
Kuo, Lung-Wen ; Lai, Chih-Chun ; Hsieh, Ming-Chi - p. 913-919 , 2020
 
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4

The Effect of Touch Screen Size on Pattern Experiments:

, In: Advances in Intelligent Systems and Computing; Advances in Usability, User Experience, Wearable and Assistive Technology,
Hsieh, Ming-Chi ; Kuo, Lung-Wen ; Lai, Chih-Chun - p. 374-379 , 2020
 
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5

Technology Products Suitability for Experimental Display Si..:

, In: Advances in Intelligent Systems and Computing; Advances in Usability, User Experience, Wearable and Assistive Technology,
Hsieh, Ming-Chi ; Kuo, Lung-Wen ; Lai, Chih-Chun - p. 225-230 , 2020
 
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6

Gate Driver Design and Device Characterization for 3.3 kV S..:

, In: 2023 IEEE Energy Conversion Congress and Exposition (ECCE),
Gutierrez, Bryan ; Hou, Zhengming ; Jiao, Dong... - p. 5983-5987 , 2023
 
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7

Benign Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
 
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8

Contactless Finger Tapping Test Based on 60 GHz Frequency-M..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
 
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9

Action Recognition with Multiple People Using Long Short-te..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
 
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10

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
 
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11

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
 
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12

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
 
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13

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passiva..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hong, Zhong-Jie ; Liu, Demin ; Hsieh, Shu-Ting... - p. 387-388 , 2022
 
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14

A Preliminary Study on the Effect of Somatosensory Games up..:

, In: Lecture Notes in Computer Science; Cross-Cultural Design. Experience and Product Design Across Cultures,
Lin, Hsuan ; Hsiao, Ming-Yu ; Hsieh, Yu-Chen... - p. 127-140 , 2021
 
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