E-LIB Suche - Ergebnisse für: Hsu, C.-K.

1

HV-CV Analysis Trapping Behavior in 650V pGaN HEMT with Fie..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Lin, Y.S. ; Yang, Cheng Hsun ; Wang, C.H.... - p. 2C.4-1-2C.4-6 , 2024

Link: https://doi.org/10.1109/..

2

Investigation of voltage-dependent thermal property in high..:

, In: 2012 24th International Symposium on Power Semiconductor Devices and ICs,

Chu, Chen-Liang ; Hu, C.M. ; Huang, C.F.... - p. 117-119 , 2012

Link: https://doi.org/10.1109/..

3

ST-MAC: Spatial-Temporal MAC Scheduling for Underwater Sens..:

, In: IEEE INFOCOM 2009,

Hsu, C.-C. ; Lai, K.-F. ; Chou, C.-F.. - p. None , 2009

Link: https://doi.org/10.1109/..

4

Implementation of an AI-based competitive cheerleading coac..:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),

Yang, C.-H. ; Tu, J.-Y. ; Wu, D.-S.... - p. None , 2023

Link: https://doi.org/10.1049/..

5

Optimization of Temporary Wafer Bonding Materials and Proce..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Ou-Yang, T. Y. ; Chang, H. H. ; Hsu, C. K. - p. 36-39 , 2020

Link: https://doi.org/10.1109/..

6

5.3 An Up-to-1400nm 500MHz Demodulated Time-of-Flight Image..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),

Chen, C.-L. ; Chu, S.-W. ; Chen, B.-J.... - p. 98-100 , 2020

Link: https://doi.org/10.1109/..

7

Hybrid Fan-out Package for Vertical Heterogeneous Integrati..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Chuang, Po-Yao ; Lin, M.-L. ; Hung, S.-T.... - p. 333-338 , 2020

Link: https://doi.org/10.1109/..

8

Evaluation of Laser Releasable Temporary Bonding Adhesives ..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Ou-Yang, T. Y. ; Chang, H. H. ; Hsu, C. K... - p. 32-35 , 2020

Link: https://doi.org/10.1109/..

9

Analysis of Underfill-Polymer Interfacial Adhesive Strength..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Yeh, Shu-Shen ; Lin, P. Y. ; Hsu, C. K.... - p. 1-4 , 2020

Link: https://doi.org/10.1109/..

10

Viscoelastic Modeling for Heterogeneous Fan-out Wafer Moldi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),

Yeh, Shu-Shen ; Lin, P. Y. ; Lee, K. C.... - p. 1081-1086 , 2020

Link: https://doi.org/10.1109/..

11

The Impact of Forming Temperature and Voltage on the Reliab..:

, In: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),

Chen, G.Y. ; Lee, F.M. ; Lin, Y.Y.... - p. 1-2 , 2019

Link: https://doi.org/10.1109/..

12

Contributors:

, In: Advanced and Emerging Polybenzoxazine Science and Technology,

Alagar, M. ; Andronescu, C. ; Arslan, M.... - p. xxiii-xxv , 2017

Link: https://doi.org/10.1016/..

13

Mediated Surface Properties of Polybenzoxazines:

, In: Advanced and Emerging Polybenzoxazine Science and Technology,

Mohamed, M.G. ; Lin, R.-C. ; Hsu, K.-C.... - p. 205-219 , 2017

Link: https://doi.org/10.1016/..

14

$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Senso..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),

Steckel, J. S. ; Josse, E. ; Pattantyus-Abraham, A. G.... - p. 23.4.1-23.4.4 , 2021

Link: https://doi.org/10.1109/..

15

List of contributors:

, In: Welding and Joining of Advanced High Strength Steels (AHSS),

Biro, E. ; Chatterjee, S. ; Cretteur, L.... - p. ix , 2015

Link: https://doi.org/10.1016/..