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Hsu, Chao-Hsiang
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1

5G Network Base Station Timeline Scheduling:

, In: Advances on Broad-Band and Wireless Computing, Communication and Applications; Lecture Notes on Data Engineering and Communications Technologies,
Chen, Yu-Han ; Hsu, Chao-Hsiang ; Susanto, Heru. - p. 244-252 , 2023
Link: https://doi.org/10.1007/..
 
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2

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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3

Performance Comparison of Audio Tampering Detection Using D..:

, In: 2023 24th IEEE International Conference on Mobile Data Management (MDM),
Hsu, Hsiang-Ping ; Chang, Sheng-Chain ; Hung, Chao-Hsiang.. - p. 286-290 , 2023
Link: https://doi.org/10.1109/..
 
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4

Dual-Polarized Patch Array Antennas with Wide Beamwidth for..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
Hsu, Pei-Hsin ; Liao, Chao-Hsiang ; Sun, Jwo-Shiun... - p. 254-256 , 2023
Link: https://doi.org/10.1109/..
 
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5

optimization fingerprint reconstruction using deep learning..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Pan, Ming-Sie ; Fan, Chao-Hsin ; Lin, Yih-Lon. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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6

Design and construction of long range traceable scanning pr..:

, In: Maschinenbau von Makro bis Nano / Fakultät für Maschinenbau. [Hrsg.: Peter Scharff]
Chen, Chao-Jung ; Wu, Tsai-Fu ; Hsu, Hsiang-Han.. (2005) 
Link: http://www.db-thueringen..
 
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7

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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8

List of Contributors:

, In: Big Data Analytics for Sensor-Network Collected Intelligence,
Anbar, Ahmad ; Assem, Haytham ; Blanchet, Christophe... - p. xiii-xv , 2017
Link: https://doi.org/10.1016/..
 
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9

18.6 A 0.5nJ/pixel 4K H.265/HEVC codec LSI for multi-format..:

, In: 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers,
Ju, Chi-Cheng ; Liu, Tsu-Ming ; Lee, Kun-Bin... - p. 1-3 , 2015
Link: https://doi.org/10.1109/..
 
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10

High power 1.55 $\boldsymbol{\mu\mathrm{m}}$ DFB laser with..:

, In: 2022 28th International Semiconductor Laser Conference (ISLC),
Liu, Te-Hua ; Cheng, Hao-Tien ; Yen, Hsiang-Chun... - p. 1-2 , 2022
Link: https://doi.org/10.23919..
 
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11

Devise Sparse Compression Schedulers to Enhance FastText Me..:

, In: 49th International Conference on Parallel Processing - ICPP : Workshops,
Chao, Chen-Ting ; Chu, Wei-Hsu ; Lee, Chao-Lin... - p. 1-8 , 2020
Link: https://dl.acm.org/doi/1..
 
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12

Simulation Model of Oxide-Aperture Strain Quantum Well VCSE:

, In: 2019 IEEE Photonics Conference (IPC),
Shih, Hsiang-Yun ; Kuo, Hao-Chung ; Lin, Chien-Chung... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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13

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ma, Kai ; Bekiaris, Nikolaos ; Hsu, Ching-Hsiang... - p. 331-336 , 2024
Link: https://doi.org/10.1109/..
 
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14

Valorizing Glycerol into Valuable Chemicals Through Photoca..:

, In: Solar Light-to-Hydrogenated Organic Conversion,
Ahmed, Mohamed Tarek ; Farooqui, Shoeb Azam ; Hsu, Sheng-Hsiang.. - p. 149-234 , 2024
Link: https://doi.org/10.1007/..
 
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15

Enhanced Moving Object Detection and Tracking in Remote Sen..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
Chou, Yi-Shau ; Lee, Pei-Jun ; Bui, Trong-An. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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