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Hsu, Chih-Yuan
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1

Fine-Pitch $30\ \mu \mathrm{m}$ Cu-Cu Bonding using Electro..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yung-Sheng ; Chiang, Chun-Wei ; Hung, Yun-Ching... - p. 1115-1118 , 2023
Link: https://doi.org/10.1109/..
 
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2

Use Empirical Mode Decomposition and Ensemble Deep Learning..:

, In: 2020 IEEE 2nd International Workshop on System Biology and Biomedical Systems (SBBS),
Lin, Yuan-Yuan ; Yang, Jun-Yuan ; Kuo, Chuz-Yi... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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3

HapticSeer: A Multi-channel, Black-box, Platform-agnostic A..:

, In: Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems,
Lin, Yu-Hsin ; Wang, Yu-Wei ; Ku, Pin-Sung... - p. 1-14 , 2021
Link: https://dl.acm.org/doi/1..
 
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4

A Study on the Surface Activation of Plasma Treatment for H..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Chih-Jing ; Fang, Hsu-Nan ; Su, Tzu-Yu... - p. 1826-1829 , 2024
Link: https://doi.org/10.1109/..
 
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5

Seeing is Not Believing: Toward Forgery Detection for Hyper..:

, In: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium,
Hsu, Chih-Chung ; Jhang, Yu-An ; Ko, Min-Tso - p. 5858-5861 , 2023
Link: https://doi.org/10.1109/..
 
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6

Toward Transparent Sequence Models with Model-Based Tree Ma..:

, In: 2023 IEEE 6th International Conference on Multimedia Information Processing and Retrieval (MIPR),
Hsu, Chan ; Huang, Wei-Chun ; Wu, Jun-Ting.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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7

1st Workshop on Maritime Computer Vision (MaCVi) 2023: Chal..:

, In: 2023 IEEE/CVF Winter Conference on Applications of Computer Vision Workshops (WACVW),
Kiefer, Benjamin ; Kristan, Matej ; Pers, Janez... - p. 265-302 , 2023
Link: https://doi.org/10.1109/..
 
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8

Prior-Guided Parallel Residual Bi-Fusion Network in USV Obs..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Hsu, Chih-Chung ; Yang, Sophia ; Hou, Xiu-Yu. - p. 107-108 , 2023
Link: https://doi.org/10.1109/..
 
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9

A Simulation Study of Scaling Capability toward 10nm for th..:

, In: 2023 IEEE International Memory Workshop (IMW),
Chen, Wei-Chen ; Lue, Hang-Ting ; Hsu, Tzu-Hsuan.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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10

Study of Analog Weights Based Computing-in-Memory (CIM) usi..:

, In: 2022 IEEE Silicon Nanoelectronics Workshop (SNW),
Lue, Hang-Ting ; Fu, Chung-Hao ; Hsu, Tzu-Hsuan... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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11

A 3D Stackable DRAM: Capacitor-less Three-Wordline Gate-Con..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chen, Wei-Chen ; Lue, Hang-Ting ; Wu, Meng-Yan... - p. 26.3.1-26.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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12

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Fast Acquisition and Accurate Vital Sign Estimation with De..:

, In: 2022 IEEE 95th Vehicular Technology Conference: (VTC2022-Spring),
Chang, Hsin-Yuan ; Hsu, Chih-Hsuan ; Chung, Wei-Ho - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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14

Investigation of Methods That Greatly Improve 3D NOR Flash ..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Hsu, Tzu-Hsuan ; Lo, Chieh... - p. 10.3.1-10.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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15

First Theoretical Modeling of the Bandgap-Engineered Oxynit..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chen, Wei-Chen ; Lue, Hang-Ting ; Fan, Sheng-Ting... - p. 8.3.1-8.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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