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2022 International Electron Devices Meeting (IEDM) ,
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A 3D Stackable DRAM: Capacitor-less Three-Wordline Gate-Con..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
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First Theoretical Modeling of the Bandgap-Engineered Oxynit..:
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2020 IEEE Symposium on VLSI Technology ,
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An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:
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2020 IEEE International Memory Workshop (IMW) ,
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An Approach of 3D NAND Flash Based Nonvolatile Computing-In..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:
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Proceedings of the 16th Workshop on Adaptive and Reflective Middleware ,
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Adaptive sensing using internet-of-things with constrained ..:
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2016 18th Asia-Pacific Network Operations and Management Symposium (APNOMS) ,
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Dynamic module deployment in a fog computing platform:
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Springer Proceedings in Materials; Physics and Mechanics of New Materials and Their Applications ,
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Comparison of MRI Image Segmentation Methods for Radiation-..:
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2023 IEEE International Conference on Image Processing (ICIP) ,
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LDCformer: Incorporating Learnable Descriptive Convolution ..:
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CHI Conference on Human Factors in Computing Systems Extended Abstracts ,
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Exploring the Effect of Emotion Awareness Intervention on R..:
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2020 IEEE Conference on Virtual Reality and 3D User Interfaces (VR) ,
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Design and Initial Evaluation of a VR based Immersive and I..:
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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
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