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Hsu, Raymond K
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1

Contributors:

, In: Cardiac Electrophysiology,
ACKERMAN, MICHAEL J. ; AGUEL, FELIPE ; ALBERTE-LISTA, CESAR... - p. iii-xvi , 2004
Link: https://doi.org/10.1016/..
 
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2

CONTRIBUTORS:

, In: Textbook of Arthoscopy,
Alberta, Frank G. ; Allen, Answorth A. ; Allen, Christina R.... - p. vii-xvi , 2004
Link: https://doi.org/10.1016/..
 
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3

List of Contributors:

, In: Catheter Ablation of Cardiac Arrhythmias,
Al-Ahmad, Amin ; Andrade, Jason G. ; Anter, Elad... - p. iv-viii , 2019
Link: https://doi.org/10.1016/..
 
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4

List of Video Contributors:

, In: Retina,
Abrams, Gary W. ; Ai, Everett ; Arevalo, J. Fernando... - p. xxiii-xxiv , 2013
Link: https://doi.org/10.1016/..
 
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5

Contributors:

, In: Plastic Surgery Secrets Plus,
Afifi, Ghada Y. ; Akelman, Edward ; Argenta, Louis C.... - p. xiii-xxiv , 2010
Link: https://doi.org/10.1016/..
 
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6

CONTRIBUTORS:

, In: Female Urology,
Abrams, Paul ; Addis, Ilana Beth ; Akingba, Danita Harrison... - p. v-xi , 2008
Link: https://doi.org/10.1016/..
 
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7

List of Contributors:

, In: Interventional Spine,
Abbasi, Arjang ; Abdel-Moty, Elsayed ; Abdi, Salahadin... - p. ix-xv , 2008
Link: https://doi.org/10.1016/..
 
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8

Implementation of an AI-based competitive cheerleading coac..:

, In: IET International Conference on Engineering Technologies and Applications (ICETA 2023),
Yang, C.-H. ; Tu, J.-Y. ; Wu, D.-S.... - p. None , 2023
Link: https://doi.org/10.1049/..
 
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9

Contributors:

, In: Principles and Practice of Pediatric Infectious Diseases,
Abzug, Mark J. ; Adderson, Elisabeth E. ; Agarwal, Aastha... - p. viii-xxi , 2023
Link: https://doi.org/10.1016/..
 
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10

An 8.3-to-18Gbps Reconfigurable SCA-Resistant/Dual-Core/Bli..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Kumar, Raghavan ; Suresh, Vikram B. ; Anders, Mark A.... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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11

A 617 TOPS/W All Digital Binary Neural Network Accelerator ..:

, In: 2020 IEEE Symposium on VLSI Circuits,
Knag, Phil C. ; Chen, Gregory K. ; Sumbul, H. Ekin... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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12

25.9 Reconfigurable Transient Current-Mode Global Interconn..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Anders, Mark A. ; Kaul, Himanshu ; Kim, Seongjong... - p. 396-398 , 2020
Link: https://doi.org/10.1109/..
 
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13

Optimization of Temporary Wafer Bonding Materials and Proce..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ou-Yang, T. Y. ; Chang, H. H. ; Hsu, C. K. - p. 36-39 , 2020
Link: https://doi.org/10.1109/..
 
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14

Hybrid Fan-out Package for Vertical Heterogeneous Integrati..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chuang, Po-Yao ; Lin, M.-L. ; Hung, S.-T.... - p. 333-338 , 2020
Link: https://doi.org/10.1109/..
 
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15

Evaluation of Laser Releasable Temporary Bonding Adhesives ..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ou-Yang, T. Y. ; Chang, H. H. ; Hsu, C. K... - p. 32-35 , 2020
Link: https://doi.org/10.1109/..
 
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