Hu, C. D.
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1

Record Transconductance in Leff~30 nm Self-Aligned Replacem..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wang, L.-C. ; Li, W. ; Shanker, N.... - p. 1-2 , 2023
 
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2

Accurate Range Shift Verification by Using a Dual-View LYSO..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Xiao, Y. ; Yao, Z. ; Dong, M.... - p. 1-2 , 2023
 
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3

Research on the cooling method of the plug cone in axisymme..:

, In: 3rd International Conference on Mechanical, Aerospace and Automotive Engineering (CMAAE 2023),
Wang, X. ; Duan, Q. ; Jin, W.. - p. None , 2023
 
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4

Fast, Dense Lu-Y mixed Oxide Ceramic Scintillators:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Pandian, L. Soundara ; Muller, M. ; Wang, Y.... - p. 1-1 , 2023
 
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5

Proton-Induced Radiation Damage in Twenty cm Long LYSO:Ce a..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Wang, C. ; Zhang, L. ; Hu, C.... - p. 1-1 , 2023
 
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6

Gamma Ray-Induced Radiation Damage in Ultrafast Lu2O3:Yb Ce..:

, In: 2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD),
Zhang, L. ; Hu, C. ; Zhu, R.-Y.... - p. 1-1 , 2023
 
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7

Lifetime estimation for load-sharing systems based on Wiene..:

, In: 12th International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE 2022),
Xing, Y. ; Zhang, J. ; Du, D... - p. None , 2022
 
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8

Power lines detection of 77 GHz millimeter wave radar based..:

, In: International Conference on Radar Systems (RADAR 2022),
Chen, C. ; Yang, F. ; Hu, C.. - p. None , 2022
 
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9

Automatic Droplet Splitting and Routing Algorithm on Digita..:

, In: 2022 IEEE International Flexible Electronics Technology Conference (IFETC),
Chang, C. ; Li, G. ; Zheng, Y... - p. 1-2 , 2022
 
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10

Compact Modeling of Emerging IC Devices for Technology-Desi..:

, In: 2022 International Electron Devices Meeting (IEDM),
Pahwa, G. ; Dasgupta, A. ; Tung, C. T.... - p. 8.1.1-8.1.4 , 2022
 
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11

Enhancement in Capacitance and Transconductance in 90 nm nF..:

, In: 2022 International Electron Devices Meeting (IEDM),
Li, W. ; Wang, L. C. ; Cheema, S. S.... - p. 22.3.1-22.3.4 , 2022
 
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12

Demonstration of Low EOT Gate Stack and Record Transconduct..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Li, W. ; Wang, L. C. ; Cheema, S. S.... - p. 13.6.1-13.6.4 , 2021
 
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13

BSIM-IMG: Advanced Model for FDSOI Transistors with Back Ch..:

, In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Agarwal, H. ; Kushwaha, P. ; Dasgupta, A.... - p. 1-4 , 2020
 
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14

Analysis of Wind Induced Vibration of Stayed Cable of Sea-c..:

, In: Lecture Notes in Civil Engineering; EASEC16,
Guo, J. ; He, J. X. ; Hu, C. J.. - p. 187-198 , 2020
 
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15

SoIC for Low-Temperature, Multi-Layer 3D Memory Integration:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chen, M. F. ; Lin, C. S. ; Liao, E. B.... - p. 855-860 , 2020
 
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