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Hu, Chih-Chung
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1

Substructure Sensing in a Rail Bridge:

, In: Lecture Notes in Civil Engineering; Advances in Transportation Geotechnics IV,
Wang, Helsin ; Hu, Chih-Hsin ; Tsai, Hsin-Chu. - p. 3-13 , 2021
Link: https://doi.org/10.1007/..
 
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2

Creative Use of Vector Scan for Efficient SRAM Inspection:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Patterson, Oliver D. ; Peng, Hsiao-Chi ; Hu, Haokun.. - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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3

A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Jiang, Yu-Wei ; Hung, Min-Feng... - p. 28.2.1-28.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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4

RSS watchdog : an instant event monitor on real online n..:

, In: Proceedings of the 18th ACM conference on Information and knowledge management,
Hu, Chih-Lin ; Chou, Chung-Kuang - p. 2097-2098 , 2009
Link: https://dl.acm.org/doi/1..
 
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5

A Novel Method for Estimating Respiration Rate based on Ens..:

, In: Proceedings of the 2019 6th International Conference on Biomedical and Bioinformatics Engineering,
Chung, Iau-Quen ; Yu, Jen-Te ; Hu, Wei-Chih - p. 60-65 , 2019
Link: https://dl.acm.org/doi/1..
 
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6

SurfaceVibe : vibration-based tap & swipe tracking on ub..:

, In: Proceedings of the 16th ACM/IEEE International Conference on Information Processing in Sensor Networks,
Pan, Shijia ; Ramirez, Ceferino Gabriel ; Mirshekari, Mostafa... - p. 197-208 , 2017
Link: https://dl.acm.org/doi/1..
 
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7

Use of Botulinum Neurotoxin in Neuropathic Pain:

, In: Manual of Botulinum Toxin Therapy,
Yang, Szu-Kuan ; Jean Chung, Chen-Chih ; Hu, Chaur-Jong - p. 245-251 , 2023
Link: https://doi.org/10.1017/..
 
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8

A Novel Modelling Methodology for Underfill Molding Process..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liang, Yu En ; Sun, Chia Peng ; Hsu, Chih Chung... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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9

A Novel Equivalent Model for Underfill Molding Process On 2..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liang, Yu En ; Sun, Chia Peng ; Hsu, Chih Chung... - p. 531-538 , 2022
Link: https://doi.org/10.1109/..
 
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10

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
Link: https://doi.org/10.1109/..
 
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11

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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12

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
Link: https://doi.org/10.1109/..
 
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13

Ge Single-Crystal-Island (Ge-SCI) Technique and BEOL Ge Fin..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chung, Hao-Tung ; Shih, Bo-Jheng ; Yang, Chih-Chao... - p. 34.5.1-34.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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14

Monolithic 3D BEOL FinFET switch arrays using location-cont..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Hsieh, Ping-Yi ; Huang, Chien-Chi ; Tai, Ming-Chi... - p. 3.1.1-3.1.4 , 2019
Link: https://doi.org/10.1109/..
 
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15

Transient Thermal Damage Simulation for Novel Location-Cont..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Pin-Jun ; Shen, Chih-Ming ; Yang, Chih-Chao... - p. 104-107 , 2019
Link: https://doi.org/10.1109/..
 
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