Hu, Chih-Hung
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1

Dual Free Layer Reader for Future Recording Head:

, In: 2022 IEEE 33rd Magnetic Recording Conference (TMRC),
 
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2

Turnover Intention of High-Tech Industry Managers: A Push-P..:

, In: 2022 IEEE 28th International Conference on Engineering, Technology and Innovation (ICE/ITMC) & 31st International Association For Management of Technology (IAMOT) Joint Conference,
 
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3

A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Jiang, Yu-Wei ; Hung, Min-Feng... - p. 28.2.1-28.2.4 , 2019
 
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5

A Deep Learning-Based White Shrimp Body Length and Bait Det..:

, In: 2023 5th International Conference on Computer Communication and the Internet (ICCCI),
Hu, Wu-Chih ; Chen, Liang-Bi ; Yu, Po-Ju... - p. 60-65 , 2023
 
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6

Pipette : efficient fine-grained reads for SSDs:

, In: Proceedings of the 59th ACM/IEEE Design Automation Conference,
Bai, Shuhan ; Wan, Hu ; Huang, Yun... - p. 385-390 , 2022
 
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7

An application of circumscribed circle filter in the Multi-..:

, In: Proceedings of the 27th Annual ACM Symposium on Applied Computing,
Liu, Hong ; Hung, Chih-Cheng ; Hu, Huaifei.. - p. 33-38 , 2012
 
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8

Image segmentation of cervical vertebra in X-ray radiograph..:

, In: Proceedings of the 2011 ACM Symposium on Applied Computing,
Hu, Huaifei ; Liu, Hong ; Chen, Lili... - p. 853-858 , 2011
 
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9

Predictive Analytics for Brick Production Using LSTM and No..:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Lin, Yen-Kun ; Wu, Shan-Hung ; Hu, Yuan-Ding... - p. 587-592 , 2024
 
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10

Panelformer: Sewing Pattern Reconstruction from 2D Garment ..:

, In: 2024 IEEE/CVF Winter Conference on Applications of Computer Vision (WACV),
Chen, Cheng-Hsiu ; Su, Jheng-Wei ; Hu, Min-Chun.. - p. 443-452 , 2024
 
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11

An Exploratory Investigation into the Design of a Basketbal..:

, In: 2023 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops (VRW),
Liu, Pin-Xuan ; Pan, Tse-Yu ; Hu, Min-Chun... - p. 725-726 , 2023
 
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12

An Ultralow Forward Voltage SiC Trenched Junction-Pinched B..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
 
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13

3D Sports Field Registration via Parametric Learning:

, In: Proceedings of the 5th ACM International Conference on Multimedia in Asia Workshops,
Tsai, TsungHsun ; Ku, Calvin ; Ng, Li Xin... - p. 1-5 , 2023
 
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14

Summary of the 2023 PAIR-LITEON Competition: Embedded AI Ob..:

, In: Proceedings of the 5th ACM International Conference on Multimedia in Asia,
Ni, Yu-Shu ; Tsai, Chia-Chi ; Lin, Jyun-Syu... - p. 1-7 , 2023
 
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15

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
 
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