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Hu, Guoqi
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1

A fast range alignment approach for ISAR imaging based on m..:

, In: 2007 1st Asian and Pacific Conference on Synthetic Aperture Radar,
Liao, Hai-sham ; Hu, Guo-qi ; Xiang, Jia-bin. - p. None , 2007
Link: https://doi.org/10.1109/..
 
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2

Sintering Process Simulation of Ag Nanoparticles by Phase F..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Hu, Xiao ; Huang, Jianlin ; Poelma, Rene.. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

Reliability Analysis of Cu Sintered Die-Attach for SiC Powe..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Liu, Xu ; Wang, Shaogang ; Hu, Dong... - p. 1119-1123 , 2024
Link: https://doi.org/10.1109/..
 
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4

Investigating the Sintering Process and Mechanical Properti..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Liu, Xu ; Hu, Dong ; Li, Zichuan... - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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5

Warpage deformation analysis of AMB ceramic substrates in p..:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Hu, Dong ; Wang, Chieh ; Li, Zichuan... - p. 1-9 , 2024
Link: https://doi.org/10.1109/..
 
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6

Investigating Sintering Mechanism of 100 nm Ag Nanoparticle..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hu, Xiao ; Hu, Dong ; Poelma, Rene... - p. 1236-1240 , 2024
Link: https://doi.org/10.1109/..
 
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7

Study on Sintering Mechanism and Mechanical Properties of N..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Qian, Cheng ; Hu, Dong ; Liu, Xu... - p. 1-9 , 2023
Link: https://doi.org/10.1109/..
 
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8

Inherent Redundancy in Spiking Neural Networks:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Yao, Man ; Hu, Jiakui ; Zhao, Guangshe... - p. 16878-16888 , 2023
Link: https://doi.org/10.1109/..
 
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9

Deep Directly-Trained Spiking Neural Networks for Object De..:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Su, Qiaoyi ; Chou, Yuhong ; Hu, Yifan... - p. 6532-6542 , 2023
Link: https://doi.org/10.1109/..
 
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10

Nanoindentation characterization of sintered porous Cu nano..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Hu, Dong ; Li, Zichuan ; Fan, Jiajie. - p. 727-733 , 2023
Link: https://doi.org/10.1109/..
 
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11

Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Ph..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Wen, Minzhen ; Guo, Baotong ; Chen, Shanghuan... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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12

Real-time data transmission of cross-border e-commerce base..:

, In: 2022 4th International Conference on Smart Systems and Inventive Technology (ICSSIT),
Hu, Yuting ; Long, Guoqi ; Liu, Jinrong - p. 1118-1122 , 2022
Link: https://doi.org/10.1109/..
 
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13

Patterning of fine-features in nanoporous films synthesized..:

, In: 2022 IEEE 22nd International Conference on Nanotechnology (NANO),
Ji, Xinrui ; van Ginkel, Hendrik Joost ; Hu, Dong... - p. 238-241 , 2022
Link: https://doi.org/10.1109/..
 
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14

Dual-Gate Fet-Based Charge Sensor Enhanced by In-Situ Elect..:

, In: 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers),
Avdogmus, Hande ; van Ginkel, H. Joost ; Galiti, Anna-Danai... - p. 180-183 , 2021
Link: https://doi.org/10.1109/..
 
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15

SnS monolayer as gas sensors: Insights from a first-princip..:

, In: 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Hu, Fafei ; Tan, Chunjian ; Ye, Huaiyu.. - p. 1-6 , 2017
Link: https://doi.org/10.1109/..
 
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