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Hu, Xinping
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1

Preliminary Implementation of Adaptive Learning for Teachin..:

, In: Lecture Notes in Civil Engineering; Proceedings of The 17th East Asian-Pacific Conference on Structural Engineering and Construction, 2022,
Hu, Xinping ; Goh, Yang Miang ; Lin, Alexander. - p. 388-399 , 2023
Link: https://doi.org/10.1007/..
 
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2

CIL-BSP: Bug Report Severity Prediction based on Class Imba..:

, In: 2022 IEEE 22nd International Conference on Software Quality, Reliability, and Security Companion (QRS-C),
Su, Yu ; Hu, Xinping ; Chen, Xiang.. - p. 298-306 , 2022
Link: https://doi.org/10.1109/..
 
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3

Multidecadal Variations of Sea Surface CO2 Fugacity (fCO2) ..:

, In: Atmosphere, Earth, Ocean & Space; Changing Asia-Pacific Marginal Seas,
Wang, Hongjie ; Hu, Xinping - p. 245-263 , 2020
Link: https://doi.org/10.1007/..
 
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4

The Development of a Smart Personalized Evidence Based Medi..:

, In: Smart Health; Lecture Notes in Computer Science,
Wang, Lei ; He, Defu ; Ni, Xiaowei... - p. 292-300 , 2018
Link: https://doi.org/10.1007/..
 
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5

Flexible Workflow Driven Job Shop Manufacturing Execution a..:

, In: 2006 IEEE/WIC/ACM International Conference on Intelligent Agent Technology,
He, Yanli ; Yang, Haicheng ; He, Weiping.. - p. None , 2006
Link: https://doi.org/10.1109/..
 
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6

Test Compression for Neuromorphic Chips:

, In: 2024 IEEE European Test Symposium (ETS),
Chen, Xin-Ping ; Huang, Hsu-Yu ; Hsiao, Chu-Yun.. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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7

Wi-Fi indoor localization based on long short-term memory n..:

, In: 2023 11th International Conference on Agro-Geoinformatics (Agro-Geoinformatics),
Hu, Jiahao ; Zhang, Aiguo ; Chen, Zhen. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

A Comprehensive Study of Crack Initiation and Delamination ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wang, Hong-Guang ; Lyu, Guang-Chao ; Deng, Yun-Kai... - p. 1459-1464 , 2022
Link: https://doi.org/10.1109/..
 
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9

Interfacial Delamination Characterization and Thermo-mechan..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Chen, Bin ; Wang, Hong-Guang ; Lyu, Guang-Chao... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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10

Influences of Organic Acids in the Soldering Flux System on..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
He, Huan ; Fang, Shu ; Qin, Jun-Hu.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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11

Automatic Test Configuration and Pattern Generation (ATCPG)..:

, In: Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design,
Chiu, I-Wei ; Chen, Xin-Ping ; Hu, Jennifer Shueh-Inn. - p. 1-7 , 2022
Link: https://dl.acm.org/doi/1..
 
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12

Dual Active Layer Mg-Doped InZnO Thin-Film Transistors with..:

, In: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT),
Hu, Chun-Feng ; Zou, Zhongfei ; Wang, Mingxiang. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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13

Moisture Desorption and Hygro-Vapor-Thermal Induced Interfa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Long ; Deng, Yun-Kai ; Wang, Hong-Guang... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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14

A Comprehensive Simulation Study of Warpage of Fan-out Pane..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Deng, Yun-Kai ; Yang, Bing-Xian ; Hu, Wei-Lin. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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