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Huang, Chih Yi
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1

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
Link: https://doi.org/10.23919..
 
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2

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
Link: https://doi.org/10.23919..
 
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3

High Density IO Fan-out Design Optimization with Signal Int..:

, In: 2019 IEEE CPMT Symposium Japan (ICSJ),
Chang, Keng Tuan ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 217-221 , 2019
Link: https://doi.org/10.1109/..
 
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4

Using A Digital Twin for Verification of Automatic Fulfillm..:

, In: NOMS 2024-2024 IEEE Network Operations and Management Symposium,
Huang, Chia-Lun ; Chen, Jyh-Yuan ; Huang, Yi Chih - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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5

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
Link: https://doi.org/10.1109/..
 
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6

Semiconductor Package Design Flow and Platform Applied on F..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Youle ; Chang, Keng-Tuan ; Kuo, Hung-Chun.. - p. 21-22 , 2023
Link: https://doi.org/10.23919..
 
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7

Advanced Packaging Design Platform for Chiplets and Heterog..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1032-1037 , 2023
Link: https://doi.org/10.1109/..
 
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8

Deep Learning based Refinement for Package Substrate Routin:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Peng-Tai ; Koyama, Tsubasa ; Chang, Keng-Tuan... - p. 1871-1874 , 2023
Link: https://doi.org/10.1109/..
 
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9

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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10

Advanced Fanout Packaging Technology for Hybrid Substrate I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Lee, Teck Chong ; Chen, Rick... - p. 1362-1370 , 2022
Link: https://doi.org/10.1109/..
 
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11

Ultra High Density Package Design and Electrical Analysis i..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsieh, Tsun-Lung ; Kuo, Hung-Chun ; Jhong, Ming-Fong.. - p. 457-460 , 2019
Link: https://doi.org/10.1109/..
 
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12

The Comparison of Package Design and Electrical Analysis in..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Hsieh, Tsun-Lung ; Chou, Yuan-Hsi ; Pan, Po-Chih... - p. 1855-1860 , 2017
Link: https://doi.org/10.1109/..
 
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13

Research on the Improvement of Children's Attention Through..:

, In: Communications in Computer and Information Science; Music Intelligence,
Yang, Weijia ; Huang, Chih-Fang ; Huang, Hsun-Yi... - p. 19-31 , 2024
Link: https://doi.org/10.1007/..
 
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14

AI Powered Multi-model Content Creation For Virtual Gallery..:

, In: 2023 IEEE 14th Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON),
Chen, Yen-Wen ; Chiu, Yi-Wei ; Liu, Yu-Sin.. - p. 0704-0709 , 2023
Link: https://doi.org/10.1109/..
 
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15

Traffic Object Detection in Virtual Environments:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Lin, Bo-Yi ; Huang, Chih-Sheng ; Lin, Jia-Ming.. - p. 245-246 , 2023
Link: https://doi.org/10.1109/..
 
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