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Huang, Hai-Bo
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1

Exploitation of Geothermal Energy by Installing Gravity Hea..:

, In: Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering,
Liu, Li ; Yu, Hai-long ; Wang, Yi-ya... - p. 3604-3617 , 2022
Link: https://doi.org/10.1007/..
 
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2

Fabrication of wearable strain sensor by using a novel hybr..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Gan, Cong ; Huang, Hai-Jun ; Hou, Bin.. - p. 801-806 , 2022
Link: https://doi.org/10.1109/..
 
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3

Superb sinterability of the Cu paste consisting of bimodal ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hou, Bin ; Huang, Hai-Jun ; Wang, Chun-Meng.. - p. 2064-2070 , 2022
Link: https://doi.org/10.1109/..
 
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4

Universal Delay Compensation for Model Predictive Current C..:

, In: 2022 Asia Power and Electrical Technology Conference (APET),
Chen, Dong-Hai ; Chen, Han-Wen ; Qiu, Yu-Tao... - p. 225-230 , 2022
Link: https://doi.org/10.1109/..
 
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5

Application and System of High-Temperature Plasma Gasificat..:

, In: Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering,
Wu, Shu-cheng ; Yu, Hai-long ; Wang, Hai-bo... - p. 3618-3633 , 2022
Link: https://doi.org/10.1007/..
 
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6

Fabrication of Flexible Printed Circuits on Polyimide Subst..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Li, Cheng-Bo ; Ma, Xiao ; Huang, Hai-Jun.. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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7

A highly reliable die bonding approach for high power devic..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Huang, Hai-Jun ; Wu, Xue ; Zhou, Min-Bo. - p. 1697-1702 , 2020
Link: https://doi.org/10.1109/..
 
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8

A Data Integrity Verification Scheme Based on Blockchain an..:

, In: Communications in Computer and Information Science; Blockchain and Trustworthy Systems,
Huang, Shuai ; Xiao, Jing ; Mao, Hong-liang... - p. 442-455 , 2020
Link: https://doi.org/10.1007/..
 
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9

A bimodal core–shell structured Cu–Ag nanoparticles based c..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Huang, Hai-Jun ; Wu, Xue ; Ma, Xiao.. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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10

Effects of size distributions of copper nanoparticles on th..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Wu, Xue ; Huang, Hai-Jun ; Zhang, Ze-Jun... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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11

Relative Analysis Between Curative Effect Evaluation and El..:

, In: International Conference on Biomedical and Health Informatics; IFMBE Proceedings,
Fan, Xiao-Mao ; Huang, Xing-Xian ; Li, Ye.. - p. 175-176 , 2018
Link: https://doi.org/10.1007/..
 
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12

Braids and periodic solutions:

, In: Lecture Notes in Mathematics; Topological Fixed Point Theory and Applications,
Huang, Hai-Hua ; Jiang, Bo-ju - p. 107-123 , 1989
Link: https://doi.org/10.1007/..
 
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13

Underwater Cage Boundary Detection Based on GLCM Features b..:

, In: 2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM),
Shi, Xiaoting ; Huang, Hai ; Wang, Bo.. - p. 1169-1174 , 2019
Link: https://doi.org/10.1109/..
 
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14

List of contributors:

, In: Water Security: Big Data-Driven Risk Identification, Assessment and Control of Emerging Contaminants,
Abdelkarim, Esraa A. ; Ali, Sameh S. ; Al-Tohamy, Rania... - p. xvii-xxiv , 2024
Link: https://doi.org/10.1016/..
 
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15

Shear performance of BGA structure Cu/Sn-3.0Ag-0.5Cu/Cu sol..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Gui, Jun ; Li, Xing-Min ; Li, Wang-Yun... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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