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Huang, Hung-Hsien
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1

Mold Flow Strategy Improvement for Power Module:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Bing-Yuan ; Lu, Ying-Xu ; Huang, Hung-Hsien.. - p. 167-168 , 2024
Link: https://doi.org/10.23919..
 
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2

Innovative Two-Phase Immersion Cooling Solutions for high-p..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sharma, Sumit ; Ahmad, Aqbal ; Huang, ICheng... - p. 1515-1515 , 2024
Link: https://doi.org/10.1109/..
 
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3

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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4

Improved Compact Thermal Model for Over-Molded Packages:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tseng, Lev ; Chang, Yu- Hsiang ; Huang, Bo-Yu... - p. 187-190 , 2023
Link: https://doi.org/10.1109/..
 
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5

Mechanical and Thermal Characterization Analysis of Chip-la..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yin, Wei-Jie ; Lai, Wei-Hong ; Lu, Ying-Xu... - p. 1711-1719 , 2022
Link: https://doi.org/10.1109/..
 
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6

Development of Ultra-Thin Thermal Ground Plane with High Pe..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Hu, Ian ; Huang, Hung-Hsien ; Huang, Po-Cheng... - p. 97-103 , 2020
Link: https://doi.org/10.1109/..
 
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7

Air-Coupled Piezoelectric Micromachining Ultrasonic Transdu..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Kao, Chien-Lun ; Hsu, Han-Jen ; Lin, Hsiao-Chi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Development of Machine Learning Based Real-Time Squat Train..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Tai, Sheng-Kwei ; Lin, Fu-Sung ; Li, Yu-Hao... - p. 376-379 , 2023
Link: https://doi.org/10.1109/..
 
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9

Intelligent Gait Parameter Analysis System Based on Deep Le..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
Chiu, Yi-Hung ; Tsai, Cheng-Yeh ; Ouyang, Chen-Sen... - p. 84-87 , 2023
Link: https://doi.org/10.1109/..
 
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10

Investigation of Emitting Liquid with Various Sizes to the ..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Shen, Shih-Hung ; Lian, Han-Wei ; Huang, Yu-Wen... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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11

Operating Characteristics of a Vanadium Redox Flow Battery-..:

, In: 2022 IEEE Industry Applications Society Annual Meeting (IAS),
Wang, Li ; Huang, Zhi-Hong ; Tseng, Ching-Wen... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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12

Contactless Ultrasound Droplet Manipulation System for Mixi..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Chu, Yu-Chun ; Shen, Shih-Hung ; Huang, Man-Ching... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

A Flow Battery-based Energy-Storage System Integrated into ..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
Wang, Li ; Huang, Zhi-Hong ; Lai, Jui-Tse... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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14

Realistic fault models and fault simulation for quantum dot..:

, In: Proceedings of the 57th ACM/EDAC/IEEE Design Automation Conference,
Hsieh, Cheng-Yun ; Wu, Chen-Hung ; Huang, Chia-Hsien.. - p. 1-6 , 2020
Link: https://dl.acm.org/doi/1..
 
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15

Realistic Fault Models and Fault Simulation for Quantum Dot..:

, In: 2020 57th ACM/IEEE Design Automation Conference (DAC),
Hsieh, Cheng-Yun ; Wu, Chen-Hung ; Huang, Chia-Hsien.. - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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