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Huang, Wen-Han
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1

Distributed Shor's Algorithm with Sequential Quantum Telepo..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Jiang, Jehn-Ruey ; Wang, Ting-Yuan ; Huang, Wen-Han. - p. 479-484 , 2023
Link: https://doi.org/10.1109/..
 
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2

Miscellaneous Disorder of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Chung, Chen-Shuan ; Lee, Tzong-His ; Chou, Jen-Wei... - p. 85-108 , 2023
Link: https://doi.org/10.1007/..
 
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3

Study on Effcet of Computer Assisted Instruction Via Analys..:

, In: 2022 IEEE 5th Eurasian Conference on Educational Innovation (ECEI),
Hong, Han-Guo ; Huang, Wen-Lin ; Twu, Shih-Hsiung - p. 412-415 , 2022
Link: https://doi.org/10.1109/..
 
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4

Marketing Technologies in the Agri-Food Industry: A Scoping..:

, In: 2021 IEEE 21st International Conference on Communication Technology (ICCT),
Liao, Han-Teng ; Huang, Wen-Yen - p. 829-833 , 2021
Link: https://doi.org/10.1109/..
 
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5

A Research and Education Agenda Based on a Bibliometric Ana..:

, In: 2021 IEEE 2nd International Conference on Technology, Engineering, Management for Societal impact using Marketing, Entrepreneurship and Talent (TEMSMET),
Liao, Han-Teng ; Huang, Wen-Yen ; Zhou, Xiumei... - p. 1-7 , 2021
Link: https://doi.org/10.1109/..
 
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6

Investigation of Emitting Liquid with Various Sizes to the ..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Shen, Shih-Hung ; Lian, Han-Wei ; Huang, Yu-Wen... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

SNC SADP Spacer etch process development using carbon hard ..:

, In: 2022 China Semiconductor Technology International Conference (CSTIC),
Liu, Hao ; Zhang, Jian-kun ; Zhao, Zun-hua... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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8

Mammography Quality Evaluation and Model Interpretation Bas..:

, In: 2022 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Zeng, Yi-Chong ; Wu, Yu-Cheng ; Yeh, Chen-Yen... - p. 1259-1264 , 2022
Link: https://doi.org/10.23919..
 
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9

FoodBender: Activating Utensil for Playing in the Immersive..:

, In: SIGGRAPH Asia 2020 XR,
Lee, Dan-Feng ; Huang, Xiang-Wen ; Chen, Yu-Chia... - p. 1-2 , 2020
Link: https://dl.acm.org/doi/1..
 
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10

Power aware SID-based simulator for embedded multicore DSP ..:

, In: Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis,
Lin, Cheng-Yen ; Chen, Po-Yu ; Tseng, Chun-Kai... - p. 95-104 , 2010
Link: https://dl.acm.org/doi/1..
 
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11

Improving Dino-Based Self-Supervised Speaker Verification w..:

, In: 2023 IEEE International Conference on Acoustics, Speech, and Signal Processing Workshops (ICASSPW),
Han, Bing ; Huang, Wen ; Chen, Zhengyang. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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12

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
Link: https://doi.org/10.1109/..
 
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13

Universal Delay Compensation for Model Predictive Current C..:

, In: 2022 Asia Power and Electrical Technology Conference (APET),
Chen, Dong-Hai ; Chen, Han-Wen ; Qiu, Yu-Tao... - p. 225-230 , 2022
Link: https://doi.org/10.1109/..
 
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14

Investigation of Low Temperature Co-Co Direct Bonding and C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liu, Demin ; Mei, Kuan-Chun ; Hu, Han-Wen... - p. 187-193 , 2022
Link: https://doi.org/10.1109/..
 
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15

Advanced 2.5D Heterogeneous Integrated Platform Using Flexi..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Ku, Shu-Yun ; Tsai, Yi-Chieh ; Chou, Tzu-Chieh... - p. 1020-1025 , 2021
Link: https://doi.org/10.1109/..
 
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