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Hung, Chin-Chang
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1

AIoTs for Smart Shrimp Farming:

, In: 2019 International SoC Design Conference (ISOCC),
Huang, Ing-Jer ; Kuang, Shiann-Rong ; Chang, Yun-Nan... - p. 17-18 , 2019
Link: https://doi.org/10.1109/..
 
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2

Physical Model for Rapid Thermal Annealing (RTA) Induced Me..:

, In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Lin, Tingyou ; Lee, Jian-Hsing ; Wu, Cheng-Tsung... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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3

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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4

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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5

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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6

Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chang, Hsiang-Hung... - p. 319-324 , 2024
Link: https://doi.org/10.1109/..
 
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7

Dual-Polarized Dipole Array Antenna with Tilt Angle for Sub..:

, In: 2023 Asia-Pacific Microwave Conference (APMC),
Chang, Chin-Cheng ; Chen, Hua-Ming ; Lin, Yi-Fang... - p. 64-66 , 2023
Link: https://doi.org/10.1109/..
 
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8

Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Yang, Shih-Chi ; Ong., Jia-Juen ; Tran, Dinh-Phuc... - p. 13-14 , 2023
Link: https://doi.org/10.23919..
 
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9

An Application-Aware Clustering Strategy in Vehicular Ad Ho..:

, In: 2023 International Conference on Computing, Electronics & Communications Engineering (iCCECE),
Wei, Chi-Hung ; Chang, Chin-Chih ; Chu, Chien-Hao. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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10

Demonstration of A 3D Chip by Logic-DRAM Stacked Using Pair..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Chen, Chun Cheng ; Lin, Sheng-Chieh... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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11

A Shoe Shopping System based on Convolutional Neural Networ..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Chang, Chin-Chih ; Wei, Chi-Hung ; Chen, Chen-Sheng... - p. 305-309 , 2023
Link: https://doi.org/10.1109/..
 
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12

Using Stellar Consensus Protocol to Ensure the Security of ..:

, In: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom),
Jang, Hung-Chin ; Chang, Che-Wei - p. 330-337 , 2023
Link: https://doi.org/10.1109/..
 
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13

Cuisine Image Recognition and Recommender System using Conv..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Chang, Chin-Chih ; Wei, Chi-Hung ; Wu, Kuan-Yun.. - p. 421-425 , 2023
Link: https://doi.org/10.1109/..
 
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14

A Fitness Movement Evaluation System Using Deep Learning:

, In: 2023 15th International Conference on Knowledge and Systems Engineering (KSE),
Chang, Chin-Chih ; Wei, Chi-Hung ; Wu, Hao-Wei. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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15

Machine Learning Approach to IoT- Based Water Quality Monit..:

, In: 2023 IEEE 5th Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability (ECBIOS),
Chang, Chin-Chih ; Wei, Chi-Hung ; Lin, Min-Tien. - p. 182-186 , 2023
Link: https://doi.org/10.1109/..
 
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