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Hung, Kuang-Chen
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1

Common Vertex Buffer LOD: A Novel Discrete LOD Approach to ..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
Chen, Hung-Kuang - p. 103-106 , 2023
Link: https://doi.org/10.1109/..
 
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2

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Die..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Liang, Ying-Hung ; Chiu, Yuan-Chieh ; Yang, Zusing... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

Radar-Camera-Based Cross-Modal Bi-Contrastive Learning for ..:

, In: 2024 IEEE Wireless Communications and Networking Conference (WCNC),
Chen, Yuh-Shyan ; Cheng, Kuang-Hung - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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5

AutoML for Large Capacity Modeling of Meta's Ranking System:

, In: Companion Proceedings of the ACM on Web Conference 2024,
Yin, Hang ; Liu, Kuang-Hung ; Sun, Mengying... - p. 374-382 , 2024
Link: https://dl.acm.org/doi/1..
 
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6

Rankitect: Ranking Architecture Search Battling World-class..:

, In: Companion Proceedings of the ACM on Web Conference 2024,
Wen, Wei ; Liu, Kuang-Hung ; Fedorov, Igor... - p. 73-82 , 2024
Link: https://dl.acm.org/doi/1..
 
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7

Transformer-Sequential-Based Learning for Continuous HMR wi..:

, In: 2023 IEEE Wireless Communications and Networking Conference (WCNC),
Chen, Yuh-Shyan ; Cheng, Kuang-Hung ; Xu, You-An - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Chih-Chin ; Hsiao, Ching-Hung ; Chen, Yi-Che... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Thermal Design of SiC Power Module for EV/HEV Applications:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liu, Chun-Kai ; Po-Kai, Chiu ; Huang, Yuan-Cheng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

A Deep Learning Model for Extracting Live Streaming Video H..:

, In: Proceedings of the 2019 2nd Artificial Intelligence and Cloud Computing Conference,
Han, Hung-Kuang ; Huang, Yu-Chen ; Chen, Chien Chin - p. 75-81 , 2019
Link: https://dl.acm.org/doi/1..
 
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11

Tungsten Gate Replacement Process Optimization in 3D NAND M..:

, In: 2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM),
Luoh, Tuung ; Huang, YuKai ; Chen, Chi-Min... - p. 1-4 , 2019
Link: https://doi.org/10.23919..
 
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12

Reduction of wafer arcing during high aspect ratio etching:

, In: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Hung, Min-Feng ; Chang, Kuo-Pin... - p. 421-425 , 2017
Link: https://doi.org/10.1109/..
 
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13

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
Link: https://doi.org/10.1109/..
 
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14

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
Link: https://doi.org/10.1109/..
 
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15

Comparison of Acceptance in Mobile Smart Wearable Technolog..:

, In: 2020 International Wireless Communications and Mobile Computing (IWCMC),
Liao, Hung-Yi ; Chen, Jih-Kuang - p. 1413-1417 , 2020
Link: https://doi.org/10.1109/..
 
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