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Hung, Ming-Ya
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1

Irregular Bumps Design Planning for Modern Ball Grid Array ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chang, Hsin-Yu ; Chen, Hung-Ming ; Kuo, Yun-Chih... - p. 1838-1843 , 2020
Link: https://doi.org/10.1109/..
 
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2

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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3

Enhancing Elderly Care through a 3D Interactive Simulation ..:

, In: Proceedings of the 2024 International Conference on Information Technology, Data Science, and Optimization,
Lee, Shao-Lun ; Hung, Lun-Ping ; Yeh, Ming-Kuei... - p. 48-56 , 2024
Link: https://dl.acm.org/doi/1..
 
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4

The Enhancement of Classification of Imbalanced Dataset for..:

, In: Communications in Computer and Information Science; New Trends in Computer Technologies and Applications,
Huang, Chih-Ming ; Hsu, Ming-Ya ; Hung, Chuan-Sheng.. - p. 212-222 , 2022
Link: https://doi.org/10.1007/..
 
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5

Contributors:

, In: Tea in Health and Disease Prevention,
Abbas, Sami ; AbouLaila, Mahmoud ; Acquas, Elio... - p. xvii-xxxviii , 2013
Link: https://doi.org/10.1016/..
 
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6

Study of Frequency Capability of 1.7kV SiC MOSFET with Curr..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Chen, Hua-Mao ; Shen, Shih-Chiang ; Yen, Chih-Hung... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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7

UV-VIS Dual-band Method for Optical Refractive Index Measur..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),
Liu, Yung-Fu ; Hsieh, Ya-Hui ; Yeh, Feng-Ming... - p. 373-376 , 2024
Link: https://doi.org/10.1109/..
 
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8

Research on Optical Axis Adjustment Method of Three-band Op..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),
Chen, Wei-Hsin ; Liu, Yung-Fu ; Yeh, Feng-Ming... - p. 369-372 , 2024
Link: https://doi.org/10.1109/..
 
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9

Layout Guidelines against Charging Damage from the Well-Sid..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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10

21.4 A -108dBc THD+N, 2.3mW Class-H Headphone Amplifier wit..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Shon-Hang ; Hsiao, Chuan-Hung ; Huang, Yi-Wei... - p. 384-386 , 2024
Link: https://doi.org/10.1109/..
 
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11

Orbeez-SLAM: A Real-time Monocular Visual SLAM with ORB Fea..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
Chung, Chi-Ming ; Tseng, Yang-Che ; Hsu, Ya-Ching... - p. 9400-9406 , 2023
Link: https://doi.org/10.1109/..
 
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12

Research on the Influence of On-the-go Cross-store Access t..:

, In: Innovative Mobile and Internet Services in Ubiquitous Computing; Lecture Notes on Data Engineering and Communications Technologies,
Chan, Ya-Lan ; Chen, Po-Hung ; Hsu, Sue-Ming. - p. 381-388 , 2023
Link: https://doi.org/10.1007/..
 
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13

An intelligent Ama safety protection system based on smart ..:

, In: 2023 Sixth International Symposium on Computer, Consumer and Control (IS3C),
Lin, Bo-Yan ; Huang, Wei-Che ; Wu, Ming-Siang... - p. 122-125 , 2023
Link: https://doi.org/10.1109/..
 
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14

Supplement of iron abrogates SARS-CoV-2 pseudovirus infecti..:

, In: 2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE),
Shih, Yu-Yin ; Lin, Chun-Hung ; Liu, Kuan-Ting... - p. 134-136 , 2022
Link: https://doi.org/10.1109/..
 
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15

Integrating Feature and Instance Selection Techniques in Op..:

, In: Research Anthology on Implementing Sentiment Analysis Across Multiple Disciplines,
You, Zi-Hung ; Hu, Ya-Han ; Tsai, Chih-Fong. - p. 800-815 , 2022
Link: https://doi.org/10.4018/..
 
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