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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:
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2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
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A 5G FR2 n260/n259 Phased-Array Transmitter Front-End IC in..:
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2023 IEEE International Memory Workshop (IMW) ,
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Process Improvements for 7th Generation 1Tb Quad-Level Cell..:
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2022 International Conference on Engineering and Emerging Technologies (ICEET) ,
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Shapelet Selection for Efficient Time Series Classification..:
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Coronavirus (COVID-19) Outbreaks, Vaccination, Politics and Society ,
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Lessons from COVID-19 Vaccine Rollout in Hong Kong and Sout..:
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2022 9th IEEE RAS/EMBS International Conference for Biomedical Robotics and Biomechatronics (BioRob) ,
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Empirical Validation of an Auxetic Structured Foot With the..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
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Highly Reliable Cell Characteristics with CSOB(Channel-hole..:
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2021 18th International Conference on Ubiquitous Robots (UR) ,
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3D-Printable Toe-joint Design of Prosthetic Foot:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
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22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:
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ACM SIGGRAPH 98 Conference abstracts and applications ,
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Virtual stage : an interactive 3D karaoke system:
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2024 IEEE International Memory Workshop (IMW) ,
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A Novel 3D Gate-All-Around Vertical FeFET with Back-Gate St..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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