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Hur, Yun-Su
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1

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Jung, Wontaeck ; Kim, Hyunggon ; Kim, Do-Bin... - p. 236-237 , 2024
Link: https://doi.org/10.1109/..
 
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2

A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Park, Myeong-Jae ; Cho, Ho Sung ; Yun, Tae-Sik... - p. 444-446 , 2022
Link: https://doi.org/10.1109/..
 
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3

A 5G FR2 n260/n259 Phased-Array Transmitter Front-End IC in..:

, In: 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Yun, Jongwon ; Lim, Hongkie ; Jeong, Jaeyeon... - p. 267-270 , 2024
Link: https://doi.org/10.1109/..
 
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4

Process Improvements for 7th Generation 1Tb Quad-Level Cell..:

, In: 2023 IEEE International Memory Workshop (IMW),
Chung, Soochan ; Ko, Dong-Hyeon ; Lim, Joonsung... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Shapelet Selection for Efficient Time Series Classification..:

, In: 2022 International Conference on Engineering and Emerging Technologies (ICEET),
Yun, Hyungseok ; Ahn, Gilseung ; Hur, Sun - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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6

Lessons from COVID-19 Vaccine Rollout in Hong Kong and Sout..:

, In: Coronavirus (COVID-19) Outbreaks, Vaccination, Politics and Society,
Koh, Keumseok ; Lam, Yun Fat ; Hur, Hyungjo - p. 99-115 , 2022
Link: https://doi.org/10.1007/..
 
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7

Empirical Validation of an Auxetic Structured Foot With the..:

, In: 2022 9th IEEE RAS/EMBS International Conference for Biomedical Robotics and Biomechatronics (BioRob),
Hong, Woolim ; Kumar, Namita Anil ; Patrick, Shawanee'... - p. 01-08 , 2022
Link: https://doi.org/10.1109/..
 
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8

Highly Reliable Cell Characteristics with CSOB(Channel-hole..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Kang, Jin-kyu ; Lee, Jaeduk ; Yim, Yongsik... - p. 10.1.1-10.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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9

3D-Printable Toe-joint Design of Prosthetic Foot:

, In: 2021 18th International Conference on Ubiquitous Robots (UR),
Um, Hui-Jin ; Kim, Heon-Su ; Hong, Woolim.. - p. 9-13 , 2021
Link: https://doi.org/10.1109/..
 
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10

22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lee, Dong Uk ; Cho, Ho Sung ; Kim, Jihwan... - p. 334-336 , 2020
Link: https://doi.org/10.1109/..
 
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11

Severance Pay Reform in the Republic of Korea:

, In: Reforming Severance Pay,
Yun, Jungyoll ; Hur, Jai-Joon - p. 195-209 , 2011
Link: https://doi.org/10.1596/..
 
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12

Virtual stage : an interactive 3D karaoke system:

, In: ACM SIGGRAPH 98 Conference abstracts and applications,
Lee, KeeChang ; Sui, ChangWhan ; Hur, SungJoon. - p. 280 ff. , 1998
Link: https://dl.acm.org/doi/1..
 
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13

A Novel 3D Gate-All-Around Vertical FeFET with Back-Gate St..:

, In: 2024 IEEE International Memory Workshop (IMW),
Ku, Boncheol ; Sim, Jae-Min ; Hur, Jae Seok... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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14

Novel Strategies for Highly Uniform and Reliable Cell Chara..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Lee, Changhwan ; Yu, Min-Tai ; Park, Sejun... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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