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Hwang, Chun
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1

13.3 A 280-Layer 1Tb 4b/cell 3D-NAND Flash Memory with a 28..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Jung, Wontaeck ; Kim, Hyunggon ; Kim, Do-Bin... - p. 236-237 , 2024
Link: https://doi.org/10.1109/..
 
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2

Benign Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
Chou, Jen-Wei ; Huang, Shang-Fen ; Chen, Chung-Wei... - p. 1-17 , 2023
Link: https://doi.org/10.1007/..
 
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3

Taiwanese Hakka Across Taiwan Corpus and Formosa Speech Rec..:

, In: 2023 26th Conference of the Oriental COCOSDA International Committee for the Co-ordination and Standardisation of Speech Databases and Assessment Techniques (O-COCOSDA),
Liao, Yuan-Fu ; Hwang, Shaw-Hwa ; Chen, You-Shuo... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

A 26.5-GHz 4x2 Array Switched Beam-Former Based on 2-D Butl..:

, In: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Lee, Youngjoo ; Kim, Juwon ; Kwon, Sungwon... - p. 49-52 , 2023
Link: https://doi.org/10.1109/..
 
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5

Cost-Benefit Analysis and Feed-In Pricing Policy Recommenda..:

, In: 2023 10th International Conference on Power and Energy Systems Engineering (CPESE),
Hwang, Tsung-Ling ; Tseng, William Wei-Chun - p. 366-371 , 2023
Link: https://doi.org/10.1109/..
 
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6

Real-time stock market analytics for improving deployment a..:

, In: Proceedings of the 16th ACM International Conference on Distributed and Event-Based Systems,
Wang, Suyeon ; Kim, Jaekyeong ; Yang, Yoonsang... - p. 171-175 , 2022
Link: https://dl.acm.org/doi/1..
 
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7

High Gain and Low Back Radiation and Thin Antenna Designs U..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Hwang, Lih-Tyng ; Wang, Chun-Cheng ; Lin, Hung-Chih.. - p. 103-108 , 2022
Link: https://doi.org/10.1109/..
 
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8

A 1ynm 1.25V 8Gb, 16Gb/s/pin GDDR6-based Accelerator-in-Mem..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Lee, Seongju ; Kim, Kyuyoung ; Oh, Sanghoon... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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9

A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibra..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Park, Myeong-Jae ; Cho, Ho Sung ; Yun, Tae-Sik... - p. 444-446 , 2022
Link: https://doi.org/10.1109/..
 
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10

Machine Learning Detection for Financial Statement Fraud:

, In: Information Systems and Technologies; Lecture Notes in Networks and Systems,
Hwang, Ting-Kai ; Chen, Wei-Chun ; Chiang, Wan-Chi. - p. 148-154 , 2022
Link: https://doi.org/10.1007/..
 
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11

System Architecture and Software Stack for GDDR6-AiM:

, In: 2022 IEEE Hot Chips 34 Symposium (HCS),
Kwon, Yongkee ; Vladimir, Kornijcuk ; Kim, Nahsung... - p. 1-25 , 2022
Link: https://doi.org/10.1109/..
 
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12

Decoding the Performance of a Memory Task Using Single-tria..:

, In: 2022 10th International Winter Conference on Brain-Computer Interface (BCI),
Lee, Hyung-Tak ; Jun, Soyeon ; Kim, June Sic.. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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13

Evaluating Pulse Simulator Using Fluorescent DIC:

, In: Thermomechanics & Infrared Imaging, Inverse Problem Methodologies, Mechanics of Additive & Advanced Manufactured Materials, and Advancements in Optical Methods & Digital Image Correlation, Volume 4; Conference Proceedings of the Society for Experimental Mechanics Series,
Hwang, Chi-Hung ; Weng, Rui-Cian ; Lu, Yen-Pei... - p. 49-56 , 2022
Link: https://doi.org/10.1007/..
 
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14

A 640×480 Indirect Time-of-Flight Image Sensor with Tetra P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Kang, Jubin ; Park, Yongjae ; Hwang, Jung-Hye... - p. 44-45 , 2022
Link: https://doi.org/10.1109/..
 
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15

dg.o 2022: Opportunities and Risks in Intelligent Governanc..:

, In: DG.O2021: The 22nd Annual International Conference on Digital Government Research,
Kim, Dongwook ; Sung, Wookjoon ; Chung, Choong-Sik... - p. 579-581 , 2021
Link: https://dl.acm.org/doi/1..
 
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