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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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A Time and Cost-Efficient Design Methodology to Estimate Ef..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Thermal Improvement of HBM with Joint Thermal Resistance Re..:
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2021 IEEE International Interconnect Technology Conference (IITC) ,
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Fabrication and Characterization of ISC embedded Interposer..:
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Proceedings of the 45th annual Design Automation Conference ,
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Applying passive RFID system to wireless headphones for ext..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
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A 1-Tb, 4b/Cell, 176-Stacked-WL 3D-NAND Flash Memory with I..:
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Lecture Notes in Electrical Engineering; Proceedings of the 21st International Symposium on High Voltage Engineering ,
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Assessment of Thermal and Electric Field Characteristics of..:
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2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) ,
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Shielding effectiveness estimation for shielding box having..:
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Proceedings of the 9th International Conference on Ubiquitous Information Management and Communication ,
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A method for recommending the latest news articles via MinH..:
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2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems ,
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Fabrication of Electrostatically-Actuated, In-Plane Fused Q..:
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2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. ,
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Highly Scalable Saddle-Fin (S-Fin) Transistor for Sub-50nm ..:
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Hepato-Biliary-Pancreatic Surgery and Liver Transplantation ,
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