Inoue, Tomoya
22  results:
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1

The Design and Implementation of Testbed Middleware that En..:

, In: 2022 IEEE 33rd Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC),
 
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2

ARIA : interactive damage prediction system for urban fl..:

, In: Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers,
Hiroi, Kei ; Inoue, Tomoya ; Akashi, Kunio... - p. 284-287 , 2019
 
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3

Fundamental Study of Underwater Multi-Stage Contactless Pow..:

, In: 2018 OCEANS - MTS/IEEE Kobe Techno-Oceans (OTO),
 
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4

AOBAKO : A Testbed for Context-Aware Applications with P..:

, In: Proceedings of the 2018 ACM International Joint Conference and 2018 International Symposium on Pervasive and Ubiquitous Computing and Wearable Computers,
Yumura, Tsubasa ; Enomoto, Masatoshi ; Akashi, Kunio... - p. 476-479 , 2018
 
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5

GINTATE : Scalable and Extensible Deep Packet Inspection..:

, In: Proceedings of the 8th International Symposium on Information and Communication Technology,
Miura, Ryosuke ; Takano, Yuuki ; Miwa, Shinsuke. - p. 234-241 , 2017
 
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6

NETorium : high-fidelity scalable wireless network emula..:

, In: Proceedings of the 12th Asian Internet Engineering Conference,
Akashi, Kunio ; Inoue, Tomoya ; Yasuda, Shingo.. - p. 25-32 , 2016
 
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7

Using emulation to validate post-disaster network recovery ..:

, In: Proceedings of the 7th International ICST Conference on Simulation Tools and Techniques,
Beuran, Razvan ; Yasuda, Shingo ; Inoue, Tomoya.. - p. 92-97 , 2014
 
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8

A design and implementation of nickname-based sockets for a..:

, In: Proceedings of the 7th Asian Internet Engineering Conference,
Inoue, Tomoya ; Takano, Yuuki ; Miwa, Shinsuke. - p. 48-55 , 2011
 
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10

In-Depth Analysis of Bonding Interface at Die Level Hybrid ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Yoshihara, Yuki ; Fuse, Junya ; Iwata, Tomoya... - p. 3-4 , 2024
 
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11

Surface Topography Control on Cu Pad for Hybrid Bonding:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Nakayama, Kohei ; Iwata, Tomoya ; Ebiko, Sodai... - p. 1-3 , 2023
 
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12

Semilayer-Wise Partial Quantization Without Accuracy Degrad..:

, In: Artificial Neural Networks and Machine Learning – ICANN 2023; Lecture Notes in Computer Science,
Matsuda, Tomoya ; Matsumoto, Kengo ; Inoue, Atsuki.. - p. 283-295 , 2023
 
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13

Robust Measurement of Bonding Strength for Wafer-to-Wafer 3..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Fuse, Junya ; Iwata, Tomoya ; Ebiko, Sodai. - p. 105-106 , 2023
 
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14

Inorganic Temporary Direct Bonding for Collective Die to Wa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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15

Free-Space Signal Transmission Using Optical Beam Scanning ..:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
 
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