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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Moving Towards Microchannel-based Chip Cooling:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Mechanical Design and Reliability of Gold-Tin Eutectic Bond..:
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2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ,
3