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Jang, H.-N.
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1

28nm CIS-Compatible Embedded STT-MRAM for Frame Buffer Memo..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lee, K. ; Kim, D. S. ; Bak, J. H.... - p. 2.1.1-2.1.4 , 2021
Link: https://doi.org/10.1109/..
 
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2

Extended MTJ TDDB Model, and Improved STT-MRAM Reliability ..:

, In: 2022 IEEE International Reliability Physics Symposium (IRPS),
Naik, V. B. ; Lim, J. H. ; Yamane, K.... - p. 6B.3-1-6B.3-6 , 2022
Link: https://doi.org/10.1109/..
 
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3

STT-MRAM Product Reliability and Cross-Talk:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Naik, V. B. ; Yamane, K. ; Kwon, J.... - p. 366-368 , 2022
Link: https://doi.org/10.1109/..
 
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4

Fast Switching of STT-MRAM to Realize High Speed Applicatio..:

, In: 2020 IEEE Symposium on VLSI Technology,
Lee, T. Y. ; Yamane, K. ; Kwon, J.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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5

Magnetic Immunity Guideline for Embedded MRAM Reliability t..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Lee, T. Y. ; Yamane, K. ; Hau, L. Y.... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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6

A Reliable TDDB Lifetime Projection Model Verified Using 40..:

, In: 2020 IEEE Symposium on VLSI Technology,
Naik, V. B. ; Yamane, K. ; Lim, J. H.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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7

Manufacturable 22nm FD-SOI Embedded MRAM Technology for Ind..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Naik, V. B. ; Lim, J. H. ; Lee, T. Y.... - p. 2.3.1-2.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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8

Why is the Winner the Best?:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Eisenmann, M. ; Reinke, A. ; Weru, V.... - p. 19955-19966 , 2023
Link: https://doi.org/10.1109/..
 
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9

Intel PowerVia Technology: Backside Power Delivery for High..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hafez, W. ; Agnihotri, P. ; Asoro, M.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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10

E-Core Implementation in Intel 4 with PowerVia (Backside Po..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Shamanna, M. ; Abuayob, E. ; Aenuganti, G.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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11

List of contributors:

, In: Manual of Chronic Total Occlusion Percutaneous Coronary Interventions,
Abi Rafeh, Nidal ; Agostoni, Pierfrancesco ; Akyuz, Sukru... - p. xxi-xxx , 2023
Link: https://doi.org/10.1016/..
 
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12

Intel 4 CMOS Technology Featuring Advanced FinFET Transisto..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Sell, B. ; An, S. ; Armstrong, J.... - p. 282-283 , 2022
Link: https://doi.org/10.1109/..
 
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13

List of contributors:

, In: Manual of Percutaneous Coronary Interventions,
Abbott, J. Dawn ; Abi Rafeh, Nidal ; Abu Fadel, Mazen... - p. xi-xv , 2021
Link: https://doi.org/10.1016/..
 
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14

Microstructure evolution and acceleration factor (AF) of mi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Kim, Y.S. ; Hong, J.W. ; Park, Y.J.... - p. 710-715 , 2020
Link: https://doi.org/10.1109/..
 
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15

List of contributors:

, In: Gallium Oxide,
Baik, Kwang Hyeon ; Bevlin, Kristen ; Carey IV, Patrick H.... - p. xi-xiv , 2019
Link: https://doi.org/10.1016/..
 
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