Jeong, Hee-Young
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1

Using SMS to provide continuous assessment and improve heal..:

, In: Proceedings of the 2nd ACM SIGHIT International Health Informatics Symposium,
Yun, Tae-Jung ; Jeong, Hee Young ; Hill, Tanisha D.... - p. 621-630 , 2012
 
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2

TriggerHunter : designing an educational game for famili..:

, In: CHI '10 Extended Abstracts on Human Factors in Computing Systems,
Hong, Hwajung ; Jeong, Hee Young ; Arriaga, Rosa I.. - p. 3577-3582 , 2010
 
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3

Using an ecological framework to design mobile technologies..:

, In: Proceedings of the 11th International Conference on Human-Computer Interaction with Mobile Devices and Services,
 
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4

Opportunities to support parents in managing their children..:

, In: CHI '08 Extended Abstracts on Human Factors in Computing Systems,
 
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5

Clinical Sound Dataset for Covid-19 and Evaluation using Re..:

, In: 2022 37th International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC),
 
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6

Design of a novel SiC MOSFET structure for EV inverter effi..:

, In: 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD),
Lee, Jong-Seok ; Chun, Dae-Hwan ; Park, Jeong-Hee... - p. 281-284 , 2014
 
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7

13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Choi, Ikjoon ; Hong, Seunghwan ; Kim, Kihyun... - p. 234-236 , 2024
 
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8

Reliability Analysis by Charge Migration of 3D SONOS Flash ..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
 
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10

Free hand stroke based virtual sketching, deformation and s..:

, In: Proceedings of the 2005 international conference on Augmented tele-existence,
 
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11

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
 
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12

Sustainable Environmental Technologies for Advanced Semicon..:

, In: 2023 International Electron Devices Meeting (IEDM),
Lee, Hyun Chul ; Oh, Sehyeong ; Yang, Dong Sik... - p. 1-4 , 2023
 
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13

3D Embedded Power Package Module to Integrate Various Power..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Byong Jin ; Jeon, HyeongIl ; Park, DaeYoung... - p. 289-295 , 2022
 
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14

A Novel Simulation Methodology Reflecting System Power Scen..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Na, Woo-Jin ; Joo, Kun ; Sung, Rak-Joo... - p. 929-936 , 2022
 
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15

Identifying Customer Interest from Surveillance Camera Base..:

, In: 2020 IEEE International Conference on Big Data and Smart Computing (BigComp),
Lee, Jae-Jun ; Gim, U-ju ; Kim, Jeong-Hun... - p. 19-20 , 2020
 
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