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Jin Xing
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1

Numerical Simulation of Hydrogen Production from In-Situ Co..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
Jin, Xing ; Pu, Wan-fen ; Bai, Yuan-yuan.. - p. 159-171 , 2024
Link: https://doi.org/10.1007/..
 
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2

Research and Application of in Situ Gel Reinforced Foam Sys..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023,
Bai, Yuan-yuan ; Pu, Wan-fen ; Jin, Xing. - p. 1394-1408 , 2024
Link: https://doi.org/10.1007/..
 
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3

Test and evaluation of process adaptability and environment..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Sheng ; Zhang, Chenhui ; Liu, Zhidan... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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4

Evaluation of the influence of the reliability application ..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Sheng ; Zhang, Chenhui ; Zhang, Fei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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5

Identifying Erroneous Software Changes through Self-Supervi..:

, In: 2022 IEEE 33rd International Symposium on Software Reliability Engineering (ISSRE),
Wang, Xuanrun ; Yin, Kanglin ; Ouyang, Qianyu... - p. 366-377 , 2022
Link: https://doi.org/10.1109/..
 
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6

Neural Oscillations and Synchronous Analysis in ECoG during..:

, In: 2022 41st Chinese Control Conference (CCC),
Jin, Xing ; Liang, Zhenhu ; Li, Xiaoli - p. 3080-3084 , 2022
Link: https://doi.org/10.23919..
 
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7

Research on Mixed Assembly Soldering Technology of Leaded B..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Jin, Xing ; Wang, Wenlong ; Zhao, Wenzhong... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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8

Echo Weighting Design on Complementary Sets for Range Sidel..:

, In: 2022 7th International Conference on Signal and Image Processing (ICSIP),
Zhu, Jiahua ; Song, Yongping ; Ye, Jundu. - p. 95-99 , 2022
Link: https://doi.org/10.1109/..
 
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9

Study on the Process of BGA Device Bottom Filled with Therm..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Sheng ; Liu, Zhidan ; Zhang, Fei.. - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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10

Effect of Surface Treatment on Bonding Performance of Devic..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Liu, Zhidan ; Zhang, Fei ; Zhang, Sheng.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Identifying Root-Cause Metrics for Incident Diagnosis in On..:

, In: 2021 IEEE 32nd International Symposium on Software Reliability Engineering (ISSRE),
Wu, Canhua ; Zhao, Nengwen ; Wang, Lixin... - p. 91-102 , 2021
Link: https://doi.org/10.1109/..
 
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12

Two-Stage Body-Part Attention Network for Detecting Human-O..:

, In: 2020 IEEE 5th International Conference on Signal and Image Processing (ICSIP),
Li, Qiyue ; Xie, Xuemei ; Liu, Wan.. - p. 415-419 , 2020
Link: https://doi.org/10.1109/..
 
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13

2D/3D Visualization of Large-Scale Wind Field based on WebG:

, In: Proceedings of the 2020 International Conference on Aviation Safety and Information Technology,
Yao, Aijie ; Wang, Li ; Li, Jun... - p. 269-274 , 2020
Link: https://dl.acm.org/doi/1..
 
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14

Norm Establishment with Punishment Qualification Constraint..:

, In: 2020 Chinese Automation Congress (CAC),
Li, Ruodan ; Wang, Zhen ; Jin, Xing. - p. 6906-6911 , 2020
Link: https://doi.org/10.1109/..
 
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15

Lactic Acid Bacteria in Animal Breeding and Aquaculture:

, In: Lactic Acid Bacteria,
Wang, Gang ; Jin, Xing - p. 257-283 , 2019
Link: https://doi.org/10.1007/..
 
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